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MCH3431

Onsemi

MCH3431 by Onsemi

MCH3431 by Onsemi is a N-CHANNEL FET with 3.5A max drain current and 1W max power dissipation. Ideal for applications requiring high power efficiency in surface mount configurations, such as power management systems or motor control circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,162 parts In-Stock

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Vyrian

USA . 1,066 parts In-Stock

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SupplyDigital Components

Austria . 5,759 parts In-Stock

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Kulean Microsystems

USA . 3,782 parts In-Stock

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Problanco Electronics

Mexico . 3,301 parts In-Stock

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TANS Electronics

Latvia . 882 parts In-Stock

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Corphita

USA . 409 parts In-Stock

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UHIMA Technologies

Türkiye . 236 parts In-Stock

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Corohmni

South Africa . 153 parts In-Stock

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Overview

Unleash the power of innovation with the MCH3431 by Onsemi. As a top-tier manufacturer in the industry, Onsemi ensures the highest quality standards for their Power Field Effect Transistors (FET) like the MCH3431. This N-CHANNEL FET offers superior performance and reliability, making it ideal for a wide range of applications. From enhancing power efficiency to optimizing circuit designs, this single configuration device maximizes productivity and minimizes costs. Trust in the MCH3431 to deliver exceptional value, benefits, and advantages that will take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON resistance and higher current-carrying capability compared to P-CHANNEL FETs, making them a suitable choice for high-performance applications.

Configuration: SINGLE

Single configuration FETs are simpler to design with and are more commonly used in various applications due to their ease of use and reliability.

Surface Mount: YES

Surface mount FETs are compact, easy to solder, and suitable for automated assembly processes, making them ideal for space-constrained applications and mass production.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer fast switching speeds and high efficiency, making them a preferred choice for power management applications where quick response time is crucial.

Maximum Drain Current (Abs) (ID): 3.5 A

With a high maximum drain current rating of 3.5 A, this FET can handle significant current loads, making it suitable for power distribution and switching applications that require high current handling capacity.

Maximum Power Dissipation (Abs): 1 W

The low maximum power dissipation of 1 W ensures efficient operation and minimizes heat generation, making this FET suitable for applications where power efficiency is a priority.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high input impedance, low power consumption, and high switching speeds, making this FET suitable for a wide range of applications requiring efficient power management.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this FET can withstand elevated temperature environments, making it suitable for use in industrial and automotive applications where heat dissipation is a concern.

Technical Specifications

Power Field Effect Transistors (FET) MCH3431 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

3.5 A

Maximum Drain Current (ID):

3.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

MCH3431 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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