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MCH3415

Onsemi

MCH3415 by Onsemi

The Onsemi MCH3415 is a N-CHANNEL FET with 1.5A ID and 0.9W power dissipation. Ideal for applications requiring high drain current in enhancement mode operation, such as power management systems. Operating up to 150 °C, it's a single configuration SMD MOSFET suitable for various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 862 parts In-Stock

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Digiode

USA . 791 parts In-Stock

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TANS Electronics

Latvia . 6,839 parts In-Stock

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Problanco Electronics

Mexico . 5,916 parts In-Stock

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Kulean Microsystems

USA . 3,537 parts In-Stock

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SupplyDigital Components

Austria . 2,677 parts In-Stock

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Corphita

USA . 1,039 parts In-Stock

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Corohmni

South Africa . 429 parts In-Stock

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UHIMA Technologies

Türkiye . 14 parts In-Stock

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Overview

Unlock the power of innovation with the MCH3415 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their Power Field Effect Transistors. Ideal for a variety of applications, this N-CHANNEL FET offers unmatched performance and efficiency. Experience the value of enhanced mode operation, high drain current capabilities, and optimal power dissipation. Elevate your projects with the MCH3415 and discover the advantages that Onsemi brings to your designs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are preferred for high power applications as they offer lower on-resistance and higher current capabilities compared to P-CHANNEL FETs.

Configuration: SINGLE

Single configuration FETs are simpler to use and provide consistent performance in applications where only one channel is needed.

Surface Mount: YES

Surface mount FETs are easier to solder and take up less space on PCBs, making them suitable for compact electronic devices and high-density PCB designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and are easier to control in electronic circuits, making them versatile for different applications.

Maximum Drain Current (Abs) (ID): 1.5 A

With a high maximum drain current rating, this FET can handle higher current loads without overheating, making it suitable for power applications.

Maximum Power Dissipation (Abs): 0.9 W

The low power dissipation of this FET ensures efficient operation and minimizes heat generation, which is crucial for reliability in electronic systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FET technology offers good switching characteristics, low gate drive power, and high input impedance, making it ideal for various applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, ensuring reliability in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) MCH3415 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

1.5 A

Maximum Drain Current (ID):

1.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

MCH3415 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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