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MCH3416

Onsemi

MCH3416 by Onsemi

MCH3416 by Onsemi is a N-CHANNEL FET with 1.8A max drain current and 1W power dissipation. Ideal for applications requiring high efficiency in a single configuration, such as power management systems. Operating in enhancement mode, it can handle up to 150 °C temperature for reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,384 parts In-Stock

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Digiode

USA . 716 parts In-Stock

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716

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SupplyDigital Components

Austria . 8,264 parts In-Stock

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8,264

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TANS Electronics

Latvia . 5,341 parts In-Stock

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Problanco Electronics

Mexico . 3,411 parts In-Stock

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UHIMA Technologies

Türkiye . 828 parts In-Stock

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828

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Corphita

USA . 661 parts In-Stock

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661

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Kulean Microsystems

USA . 246 parts In-Stock

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Corohmni

South Africa . 65 parts In-Stock

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Overview

Discover the superior performance and reliability of the MCH3416 N-CHANNEL Power Field Effect Transistor by Onsemi. Designed for enhanced power management, this single configuration transistor offers a maximum drain current of 1.8A and a robust power dissipation of 1W. Ideal for a wide range of applications, from voltage regulators to motor control systems, the MCH3416 provides exceptional efficiency and durability. Trust in Onsemi's reputation for quality and innovation, and experience the value and benefits this transistor brings to your projects. Elevate your designs with the MCH3416 today.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL - Provides efficient conductivity and low power consumption.

Configuration

SINGLE - Simplifies circuit design and integration.

Surface Mount

YES - Easy to install and saves space on PCB.

Operating Mode

ENHANCEMENT MODE - Allows for precise control over current flow.

Maximum Drain Current (Abs) (ID)

1.8 A - Handles high current loads effectively.

Maximum Power Dissipation (Abs)

1 W - Efficiently dissipates heat to prevent overheating.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - Offers high performance and reliability.

Maximum Operating Temperature

150 °C - Can withstand high temperatures for prolonged periods.

Technical Specifications

Power Field Effect Transistors (FET) MCH3416 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

1.8 A

Maximum Drain Current (ID):

1.8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

MCH3416 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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