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MCH3446

Onsemi

MCH3446 by Onsemi

The Onsemi MCH3446 is a N-CHANNEL FET with 2.5A max drain current and 0.9W power dissipation. Ideal for applications requiring high efficiency in a single configuration, such as power management systems. Operating in enhancement mode, it can handle up to 150 °C temperature for reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,866 parts In-Stock

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Digiode

USA . 1,821 parts In-Stock

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SupplyDigital Components

Austria . 7,617 parts In-Stock

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Problanco Electronics

Mexico . 4,965 parts In-Stock

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Kulean Microsystems

USA . 4,193 parts In-Stock

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Corphita

USA . 1,299 parts In-Stock

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UHIMA Technologies

Türkiye . 936 parts In-Stock

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TANS Electronics

Latvia . 456 parts In-Stock

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Corohmni

South Africa . 70 parts In-Stock

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Overview

Power up your projects with the MCH3446 by Onsemi! This high-quality N-CHANNEL Power Field Effect Transistor offers enhanced performance and reliability for a wide range of applications. With a maximum drain current of 2.5A and a maximum power dissipation of 0.9W, this transistor is perfect for demanding tasks. Whether you're working on industrial automation, power management, or motor control, the MCH3446 delivers the value, benefits, and advantages you need to bring your designs to life. Trust Onsemi's expertise and innovation to take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs have lower ON-resistance compared to P-CHANNEL FETs, making them more efficient for high power applications.

Configuration: SINGLE

Single configuration FETs are simpler to use and suitable for basic switching applications.

Surface Mount: YES

Surface mount FETs are compact and easier to integrate into circuit boards, saving space and reducing assembly time.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require only a positive voltage to turn on, providing easier control in most applications.

Maximum Drain Current (Abs) (ID): 2.5 A

With a high maximum drain current, this FET can handle heavy loads without the risk of overheating or failure.

Maximum Power Dissipation (Abs): 0.9 W

The low power dissipation ensures efficiency and reliability in operation, reducing the need for additional cooling measures.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance characteristics, stability, and durability for various applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, ensuring reliability in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) MCH3446 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

2.5 A

Maximum Drain Current (ID):

2.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

MCH3446 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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