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MCH3410

Onsemi

MCH3410 by Onsemi

MCH3410 by Onsemi is a N-CHANNEL FET with 2A ID and 0.9W power dissipation. It operates in enhancement mode at up to 150 °C, suitable for power applications requiring high drain current and low power consumption in surface mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,315 parts In-Stock

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Vyrian

USA . 369 parts In-Stock

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369

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SupplyDigital Components

Austria . 7,212 parts In-Stock

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7,212

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TANS Electronics

Latvia . 4,274 parts In-Stock

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Kulean Microsystems

USA . 2,567 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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1,800

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Corphita

USA . 554 parts In-Stock

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UHIMA Technologies

Türkiye . 542 parts In-Stock

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542

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Problanco Electronics

Mexico . 263 parts In-Stock

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Corohmni

South Africa . 167 parts In-Stock

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Overview

Enhance your power management solutions with the MCH3410 Power Field Effect Transistor by Onsemi. With a focus on quality and reliability, Onsemi is a leader in semiconductor manufacturing, offering cutting-edge technology for a wide range of applications. The MCH3410 N-CHANNEL FET provides enhanced performance and efficiency, making it ideal for various power management needs. Trust Onsemi to deliver value and innovation, ensuring that you get the best in power transistor technology.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON-state resistance than P-CHANNEL FETs, making them more efficient for certain applications.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and can be easier to control compared to multiple configurations.

Surface Mount: YES

Surface Mount design allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

Operating Mode: ENHANCEMENT MODE

ENHANCEMENT MODE FETs are easier to control and require less power to operate, making them efficient for various applications.

Maximum Drain Current (Abs) (ID): 2 A

With a high maximum drain current, this FET can handle higher power loads, making it suitable for applications requiring higher current handling capabilities.

Maximum Power Dissipation (Abs): 0.9 W

With a maximum power dissipation of 0.9 W, this FET can effectively dissipate heat and operate reliably under high power conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

METAL-OXIDE SEMICONDUCTOR technology offers high efficiency and reliability in switching applications, making it a dependable choice for various circuits.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without compromising performance, suitable for applications in challenging environments.

Technical Specifications

Power Field Effect Transistors (FET) MCH3410 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

MCH3410 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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