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MCH3420

Onsemi

MCH3420 by Onsemi

The Onsemi MCH3420 is a N-CHANNEL FET with 0.5A max drain current and 0.8W power dissipation. Ideal for applications requiring high efficiency in a single configuration, such as power management systems. Operating in enhancement mode, it offers reliable performance up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,265 parts In-Stock

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Digiode

USA . 1,931 parts In-Stock

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1,931

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TANS Electronics

Latvia . 4,238 parts In-Stock

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Kulean Microsystems

USA . 2,448 parts In-Stock

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Problanco Electronics

Mexico . 2,444 parts In-Stock

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2,444

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SupplyDigital Components

Austria . 1,672 parts In-Stock

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UHIMA Technologies

Türkiye . 762 parts In-Stock

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762

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Corphita

USA . 565 parts In-Stock

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Corohmni

South Africa . 334 parts In-Stock

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Overview

Discover the cutting-edge MCH3420 by Onsemi, a top-quality N-CHANNEL Power FET that delivers superior performance and reliability. Manufactured by industry leader Onsemi, this single configuration FET is perfect for a variety of applications. From enhancing power efficiency to optimizing circuit designs, the MCH3420 offers unmatched value and benefits. Trust in Onsemi's expertise and choose the MCH3420 for all your power management needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs offer low on-state resistance and high current-carrying capability, making them suitable for high-power applications.

Configuration: SINGLE

Single FET configuration simplifies circuit design and reduces the number of components required, improving overall reliability and cost-effectiveness.

Surface Mount: YES

Surface mount capability allows for easy integration onto printed circuit boards, saving space and enabling automated manufacturing processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer faster switching speeds and lower conduction losses, leading to improved efficiency and performance in high-frequency applications.

Maximum Drain Current (Abs) (ID): 0.5 A

The high maximum drain current rating ensures that the FET can handle high load currents, making it suitable for power applications requiring significant current flow.

Maximum Power Dissipation (Abs): 0.8 W

The high maximum power dissipation capability allows the FET to withstand high power levels without overheating, ensuring reliable operation in demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds, low input capacitance, and low gate drive requirements, making it ideal for high-performance applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature rating enables the FET to operate reliably in elevated temperature environments, ensuring stable performance under demanding conditions.

Technical Specifications

Power Field Effect Transistors (FET) MCH3420 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.5 A

Maximum Drain Current (ID):

.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

MCH3420 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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