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MCH3411

Onsemi

MCH3411 by Onsemi

MCH3411 by Onsemi is a N-CHANNEL FET with 3A max drain current and 1W max power dissipation. Ideal for applications requiring high efficiency in a single configuration, such as power management systems. Operating in enhancement mode, it can handle up to 150 °C temperature with METAL-OXIDE SEMICONDUCTOR technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,445 parts In-Stock

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Digiode

USA . 178 parts In-Stock

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178

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Problanco Electronics

Mexico . 6,703 parts In-Stock

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6,703

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Kulean Microsystems

USA . 6,357 parts In-Stock

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SupplyDigital Components

Austria . 3,635 parts In-Stock

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TANS Electronics

Latvia . 1,701 parts In-Stock

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Corohmni

South Africa . 448 parts In-Stock

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Corphita

USA . 277 parts In-Stock

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UHIMA Technologies

Türkiye . 178 parts In-Stock

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Overview

The MCH3411 by Onsemi is a high-quality Power Field Effect Transistor that offers enhanced performance and reliability. Manufactured by industry leader Onsemi, this N-CHANNEL FET is ideal for a variety of applications. With a single configuration and surface mount capability, the MCH3411 is easy to integrate into electronic systems. Offering a maximum drain current of 3A and a maximum power dissipation of 1W, this Enhancement Mode transistor ensures efficient operation. Experience the value and benefits that the MCH3411 brings to your projects with its superior quality and advanced technology.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON-resistance and higher efficiency compared to P-CHANNEL FETs, making them a preferred choice in many applications.

Configuration: SINGLE

A single configuration simplifies circuit design and reduces chances of errors, making this FET easier to use in various projects.

Surface Mount: YES

Surface mount technology allows for smaller and lighter designs, making this FET suitable for compact electronic devices.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer fast switching speeds and precise control, making them ideal for applications where efficiency and accuracy are critical.

Maximum Drain Current (Abs) (ID): 3 A

With a high maximum drain current, this FET can handle larger loads, making it suitable for power applications that require high current capabilities.

Maximum Power Dissipation (Abs): 1 W

The low maximum power dissipation ensures minimal heat generation, improving the overall efficiency and reliability of the FET in operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance and reliability, making this FET suitable for a wide range of applications that require stable operation.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, providing flexibility in various thermal environments.

Technical Specifications

Power Field Effect Transistors (FET) MCH3411 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

MCH3411 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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