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MC74VHCT32AMG

Onsemi

MC74VHCT32AMG by Onsemi

MC74VHCT32AMG by Onsemi is a 4-function logic gate with 2 inputs, operating at 3.3V nominal voltage and 5V power supplies. It offers a propagation delay of 8.5ns, making it suitable for industrial applications requiring fast signal processing in a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,077 parts In-Stock

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AZTECH Wire

Italy . 914 parts In-Stock

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Kulean Microsystems

USA . 4,402 parts In-Stock

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TANS Electronics

Latvia . 1,014 parts In-Stock

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SupplyDigital Components

Austria . 631 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 618 parts In-Stock

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Microchip USA

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Problanco Electronics

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Corohmni

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Overview

Elevate your electronics projects with the MC74VHCT32AMG logic gate from Onsemi. Crafted with precision and quality, this small outline package offers 4 functions and 2 inputs, making it a versatile choice for various applications. With a fast propagation delay of 8.5 ns and a wide operating temperature range, this logic gate guarantees reliable performance under any conditions. Trust Onsemi's expertise in semiconductor manufacturing to deliver exceptional value and benefits to your designs. Experience seamless integration and efficiency with the MC74VHCT32AMG - your go-to solution for all your logic gate needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures quick signal processing, making the product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on PCBs, saving space and facilitating mass production.

No. of Functions: 4

With multiple functions in one component, this product offers efficiency and space-saving benefits in circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common voltage level, ensuring compatibility with various systems and reducing the need for additional components.

Load Capacitance (CL): 50 pF

The specified capacitance allows for stable performance and reliable operation in different circuit configurations.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables reliable functionality in harsh environments or varying conditions.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle higher supply voltages, providing flexibility and compatibility with different power sources.

Technical Specifications

Logic Gates MC74VHCT32AMG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74VHCT32AMG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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