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MC74VHC1G09DFT2G

Onsemi

MC74VHC1G09DFT2G by Onsemi

MC74VHC1G09DFT2G by Onsemi is a logic gate with 2 inputs, 16.5 ns propagation delay, and 8 Amp max I (ol). It operates b/w -55 to 125 °C and has a load capacitance of 50 pF. Ideal for applications requiring fast signal processing in compact spaces.

Median Price

$0.077

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

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DigiKey

USA . 245 parts In-Stock

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$0.100

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$0.035

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245

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Mouser Electronics

USA . 192 parts In-Stock

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$0.025

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Rochester

USA . 1,551,000 parts In-Stock

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-

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$0.054

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Verical

USA . 1,533,000 parts In-Stock

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Arrow

USA . 24,000 parts In-Stock

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Chip1Stop

Japan . 55 parts In-Stock

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Digiode

USA . 85 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Bristol Electronics

USA . 4,322 parts In-Stock

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$0.375

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$0.188

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4,322

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Vyrian

USA . 614,962 parts In-Stock

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Chip Stock

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Cyclops Electronics Ltd

UK . 57,000 parts In-Stock

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North Shore Components

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IBS Electronics

USA . 12,000 parts In-Stock

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Flip Electronics

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NAC Semi

USA . 6,000 parts In-Stock

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Dan-Mar Components

USA . 4,132 parts In-Stock

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R&J Components

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Ashlea Components Ltd

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First Choice Components Inc.

USA . 2,811 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Prism Electronics

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EPE Components Inc.

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Sensible Micro Corp

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Microfarads

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SPM Sales

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Ampacity Inc.

Singapore . 614,683 parts In-Stock

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Semicontronic

India . 614,554 parts In-Stock

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Corohmni

South Africa . 89 parts In-Stock

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Corphita

USA . 2,350 parts In-Stock

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Component Stockers USA

USA . 20,929 parts In-Stock

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Bastille Electronics

Australia . 650 parts In-Stock

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$0.037

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Continental Prestige Electronics

USA . 5,390 parts In-Stock

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Argo Parts USA

USA . 3,626 parts In-Stock

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Aztec Data Supply Inc.

USA . 339 parts In-Stock

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Perfect Parts

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Kepictronics

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Lixinc

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Problanco Electronics

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SupplyDigital Components

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TANS Electronics

Latvia . 4,480 parts In-Stock

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Kulean Microsystems

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Assy Fe

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UHIMA Technologies

Türkiye . 660 parts In-Stock

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Microchip USA

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GreenTree Electronics

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Overview

Elevate your electronic projects with the MC74VHC1G09DFT2G from Onsemi, a top-quality Logic Gate that promises reliability and performance. With a small outline and thin profile design, this versatile component is perfect for a range of applications, from consumer electronics to industrial machinery. Boasting a wide voltage range and low power consumption, this Logic Gate offers exceptional value and efficiency for all your circuitry needs. Trust Onsemi's expertise and invest in the MC74VHC1G09DFT2G for seamless integration and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY provides good insulation and protection for the internal components of the logic gate, making it durable and reliable.

No. of Inputs: 2

Having 2 inputs allows for more complex logic operations to be performed, offering flexibility in designing circuits.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V allows for efficient power consumption while still providing reliable performance.

Propagation Delay (tpd): 16.5 ns

With a low propagation delay, this logic gate can process signals quickly, making it suitable for high-speed applications.

Output Characteristics: OPEN-DRAIN

The open-drain output allows for easy interfacing with other components and enables flexible circuit design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this logic gate energy-efficient and reliable.

Technical Specifications

Logic Gates MC74VHC1G09DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

MC74VHC1G09DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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