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MC74LCX157DTG

Onsemi

MC74LCX157DTG by Onsemi

MC74LCX157DTG by Onsemi is a 4-function multiplexer with 2 inputs, operating at 3.3V. It offers a low propagation delay of 5.8ns and can handle load capacitance of 50pF. Ideal for industrial applications requiring fast signal switching in compact designs.

Median Price

$0.295

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 645 parts In-Stock

1+ parts

$0.630

100+ parts

$0.349

1k+ parts

$0.307

10k+ parts

-

645

$0.630

$0.349

$0.307

-

Rochester

USA . 146,833 parts In-Stock

1+ parts

-

100+ parts

$0.295

1k+ parts

$0.245

10k+ parts

$0.218

146,833

-

$0.295

$0.245

$0.218

Verical

USA . 55,680 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.273

55,680

-

-

-

$0.273

Flip Electronics (Authorized)

USA . 2,307 parts In-Stock

1+ parts

-

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2,307

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Distributors (In-Stock)

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Digiode

USA . 2,112 parts In-Stock

1+ parts

$0.147

100+ parts

-

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2,112

$0.147

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Vyrian

USA . 6,906 parts In-Stock

1+ parts

-

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6,906

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Flip Electronics

USA . 2,307 parts In-Stock

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2,307

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Prism Electronics

USA . 576 parts In-Stock

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576

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Distributors (Availability)

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Corphita

USA . 1,074 parts In-Stock

1+ parts

$0.140

100+ parts

-

1k+ parts

-

10k+ parts

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1,074

$0.140

-

-

-

Component Stockers USA

USA . 110,009 parts In-Stock

1+ parts

$0.150

100+ parts

$0.280

1k+ parts

$0.250

10k+ parts

$0.250

110,009

$0.150

$0.280

$0.250

$0.250

Corohmni

South Africa . 309 parts In-Stock

1+ parts

$0.155

100+ parts

-

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309

$0.155

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Continental Prestige Electronics

USA . 146,833 parts In-Stock

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100+ parts

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$0.209

10k+ parts

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146,833

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-

$0.209

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Perfect Parts

USA . 6,225 parts In-Stock

1+ parts

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6,225

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Microchip USA

USA . 5,831 parts In-Stock

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5,831

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TANS Electronics

Latvia . 5,683 parts In-Stock

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5,683

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Problanco Electronics

Mexico . 5,585 parts In-Stock

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5,585

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SupplyDigital Components

Austria . 5,527 parts In-Stock

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5,527

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Kulean Microsystems

USA . 2,048 parts In-Stock

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2,048

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UHIMA Technologies

Türkiye . 610 parts In-Stock

1+ parts

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610

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Overview

Unlock the power of efficient data processing with the MC74LCX157DTG by Onsemi. This high-quality multiplexer/demultiplexer offers unparalleled performance and reliability, thanks to Onsemi's reputation for excellence in semiconductor manufacturing. Ideal for a wide range of applications, this product provides superior value and benefits to customers looking for seamless signal routing and data management solutions. Trust Onsemi to deliver cutting-edge technology that meets your needs with precision and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 5.8 ns

Low propagation delay ensures quick switching between inputs and outputs, making the multiplexer/demultiplexer efficient.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and facilitating automated manufacturing processes.

No. of Functions: 4

Having 4 functions in one device allows for efficient control and management of multiple signals or data streams.

Nominal Supply Voltage: 3.3V

Operating at a standard voltage of 3.3V ensures compatibility with common power supplies and reduces the risk of voltage mismatch issues.

Maximum Operating Temperature: 85 °C

With a high operating temperature range of up to 85°C, this device is suitable for industrial environments where temperature fluctuations can occur.

Technology: CMOS

Utilizing CMOS technology enables low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Multiplexer & Demultiplexer MC74LCX157DTG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

6.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MC74LCX157DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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