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MC74LCX02MEL

Onsemi

MC74LCX02MEL by Onsemi

MC74LCX02MEL by Onsemi is a Logic Gates IC with 4 functions and 2 inputs. It has a propagation delay of 5.5 ns at 2.5V, suitable for industrial applications requiring fast signal processing in compact designs. With small outline packaging and surface mount capability, it operates within -40 to 85 °C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,777 parts In-Stock

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R&J Components

USA . 1,900 parts In-Stock

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Digiode

USA . 1,047 parts In-Stock

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AZTECH Wire

Italy . 346 parts In-Stock

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$22.140

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TANS Electronics

Latvia . 5,631 parts In-Stock

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Problanco Electronics

Mexico . 4,307 parts In-Stock

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SupplyDigital Components

Austria . 3,479 parts In-Stock

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Corphita

USA . 1,813 parts In-Stock

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Kulean Microsystems

USA . 1,338 parts In-Stock

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Microchip USA

USA . 452 parts In-Stock

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UHIMA Technologies

Türkiye . 311 parts In-Stock

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Corohmni

South Africa . 249 parts In-Stock

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Overview

Upgrade your electronic projects with the MC74LCX02MEL logic gate by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge components that exceed industry standards. Ideal for a wide range of applications, this logic gate offers fast propagation delay, low power consumption, and high-speed performance. With a compact package design and advanced technology, the MC74LCX02MEL provides exceptional value and efficiency to customers looking to enhance their circuit designs. Trust Onsemi for premium components that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring the reliability of the product.

Propagation Delay At Nominal Supply: 5.5 ns

Low propagation delay ensures fast response times, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and time during assembly.

No. of Functions: 4

With 4 functions in one unit, this product is versatile and can perform multiple logic operations efficiently.

No. of Inputs: 2

Having 2 inputs allows for basic logic operations to be performed effectively, making this product a fundamental building block in circuit design.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage makes this product compatible with a wide range of electronic systems and devices.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF ensures minimal interference and distortion in signal transmission.

Power Supplies (V): 3.3

Operating at 3.3V power supplies provides compatibility with standard electronic systems and ensures stable performance.

No. of Terminals: 14

The 14 terminals offer flexibility in connecting to other components or circuits, enabling versatile applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices.

Maximum I (ol): 24 Amp

With a high maximum output current of 24 Amps, this product can drive strong loads and handle high-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows the product to function in harsh environments without degradation in performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable operation even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, contributing to the product's longevity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C allows for efficient soldering during manufacturing, ensuring strong and reliable connections.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Packing Method: TR

The TR packing method ensures safe and secure transportation and storage of the product, reducing the risk of damage.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides flexibility in power input options, accommodating a wide range of operating conditions.

Technical Specifications

Logic Gates MC74LCX02MEL attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74LCX02MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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