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MC74HC157AFELG

Onsemi

MC74HC157AFELG by Onsemi

MC74HC157AFELG by Onsemi is a 4-function multiplexer with 2 inputs, 32ns propagation delay at 3V. It operates in temperatures from -55 to 125 °C and has a small outline package style for surface mount applications.

Median Price

$0.280

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 28,790 parts In-Stock

1+ parts

-

100+ parts

$0.291

1k+ parts

$0.241

10k+ parts

$0.215

28,790

-

$0.291

$0.241

$0.215

Verical

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.269

16,000

-

-

-

$0.269

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 672 parts In-Stock

1+ parts

$0.226

100+ parts

-

1k+ parts

-

10k+ parts

-

672

$0.226

-

-

-

Vyrian

USA . 8,832 parts In-Stock

1+ parts

-

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8,832

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 24,511 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

-

10k+ parts

-

24,511

$0.175

-

-

-

Corohmni

South Africa . 149 parts In-Stock

1+ parts

$0.206

100+ parts

-

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-

149

$0.206

-

-

-

Corphita

USA . 2,221 parts In-Stock

1+ parts

$0.214

100+ parts

-

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-

2,221

$0.214

-

-

-

AZTECH Wire

Italy . 783 parts In-Stock

1+ parts

$15.830

100+ parts

-

1k+ parts

-

10k+ parts

-

783

$15.830

-

-

-

Continental Prestige Electronics

USA . 28,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.206

10k+ parts

-

28,790

-

-

$0.206

-

Problanco Electronics

Mexico . 7,449 parts In-Stock

1+ parts

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7,449

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SupplyDigital Components

Austria . 7,312 parts In-Stock

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7,312

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Kulean Microsystems

USA . 4,974 parts In-Stock

1+ parts

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4,974

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TANS Electronics

Latvia . 757 parts In-Stock

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757

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Microchip USA

USA . 400 parts In-Stock

1+ parts

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400

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UHIMA Technologies

Türkiye . 310 parts In-Stock

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310

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Overview

Unleash the power of seamless data switching with the MC74HC157AFELG by Onsemi. Crafted with precision and expertise, this multiplexer & demultiplexer offers unparalleled quality and reliability. Perfect for a wide range of applications, this product boasts a compact design and low power consumption, making it an ideal choice for any project. Elevate your performance and efficiency with the MC74HC157AFELG, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection, making the product suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 32 ns

Low propagation delay ensures fast and efficient signal processing in the multiplexer/demultiplexer, resulting in high performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

No. of Functions: 4

The multiplexer/demultiplexer has the ability to perform multiple functions, offering versatility and efficiency in data routing.

No. of Inputs: 2

Having 2 inputs allows for flexibility in selecting and routing signals, providing options for different configurations.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes the product energy-efficient and compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures optimized signal transmission and reception, enhancing overall performance of the multiplexer/demultiplexer.

Power Supplies (V): 2/6

Supporting power supplies of 2V and 6V provides flexibility in different system configurations, making the product versatile and adaptable.

No. of Terminals: 16

Having 16 terminals allows for connectivity to multiple components in a system, enabling efficient signal routing.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs and applications where size is a constraint.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high reliability, making the product ideal for energy-efficient and reliable operation.

Temperature Grade: MILITARY

Designed to meet military-grade standards, the product ensures durability and reliability in harsh environmental conditions, making it suitable for defense and aerospace applications.

Technical Specifications

Multiplexer & Demultiplexer MC74HC157AFELG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

160 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.275 mm

Trade Compliance

MC74HC157AFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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