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MC74HC132ADTR2

Onsemi

MC74HC132ADTR2 by Onsemi

MC74HC132ADTR2 by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It has a propagation delay of 38 ns at 4.5V, suitable for military-grade applications due to its wide operating temperature range from -55 °C to 125°C. The package is small outline, thin profile, shrink pitch with dual-position terminals for surface mount assembly.

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AZTECH Wire

Italy . 467 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

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Overview

Experience the reliability and precision of Onsemi with the MC74HC132ADTR2 Logic Gates. With a focus on quality and innovation, Onsemi delivers cutting-edge technology that meets the demands of various applications. The MC74HC132ADTR2 offers customers a fast propagation delay, low power consumption, and versatile functionality, making it an ideal choice for those seeking high performance at an affordable price. Trust Onsemi to provide you with the solutions you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to impact or damage.

Propagation Delay At Nominal Supply: 38 ns

The low propagation delay ensures fast operations and efficient performance of the logic gates.

Surface Mount: YES

Surface mount option allows for easy installation and saves space on PCBs.

No. of Functions: 4

Having multiple functions in a single device is convenient and saves on component count and space.

No. of Inputs: 2

Having only 2 inputs simplifies the usage and design of the logic gates.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and integration into circuits.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V makes it compatible with a wide range of applications.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing power consumption and improving signal integrity.

Power Supplies (V): 2/6

Compatibility with power supplies ranging from 2V to 6V offers flexibility in different operating conditions.

No. of Terminals: 14

Having 14 terminals provides sufficient connectivity options for various configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style with thin profile and shrink pitch saves space on the PCB and allows for dense circuit designs.

Maximum I (ol): 4 Amp

High maximum output current of 4A allows for driving of heavy loads without external buffers.

Propagation Delay (tpd): 190 ns

While not the fastest, the propagation delay of 190 ns is still reasonable for many applications.

Maximum Operating Temperature: 125 °C

The wide operating temperature range up to 125 °C makes it suitable for harsh environments and industrial applications.

Minimum Operating Temperature: -55 °C

The product can operate efficiently in extreme cold conditions down to -55 °C.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold finish ensures good conductivity and long-term reliability of the terminals.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and connectivity options.

Maximum Seated Height: 1.2 mm

Low maximum seated height enables compact and space-efficient designs.

Width: 4.4 mm

Narrow width of 4.4mm saves space and allows for dense packing of components.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum supply voltage of 2V enables low-power applications and extends battery life.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260 °C ensures reliable solder connections during assembly.

Length: 5 mm

Compact length of 5mm further contributes to space-saving on the PCB.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliability in demanding conditions and applications.

Schmitt Trigger: YES

Inclusion of Schmitt trigger functionality helps in noise filtering and improving signal integrity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form makes it easy to solder and provides mechanical strength to the connections.

Packing Method: TR

Tray packing method ensures secure transportation and storage of the product.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65mm allows for high-density mounting on the PCB.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6V provides flexibility in different power supply configurations and applications.

Technical Specifications

Logic Gates MC74HC132ADTR2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74HC132ADTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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