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MC74HC04AFELG

Onsemi

MC74HC04AFELG by Onsemi

MC74HC04AFELG by Onsemi is a CMOS Logic Gates IC with 6 functions, 22ns propagation delay, and 3V nominal voltage. Ideal for military-grade applications due to its small outline package and dual terminal position.

Median Price

$0.379

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 74,748 parts In-Stock

1+ parts

-

100+ parts

$0.357

1k+ parts

$0.296

10k+ parts

$0.264

74,748

-

$0.357

$0.296

$0.264

Verical

USA . 72,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.401

10k+ parts

$0.330

72,000

-

-

$0.401

$0.330

Distributors (In-Stock)

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Digiode

USA . 826 parts In-Stock

1+ parts

$0.277

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-

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826

$0.277

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Vyrian

USA . 2,293 parts In-Stock

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2,293

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Sogenti Electronics

Canada . 1,700 parts In-Stock

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1,700

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Distributors (Availability)

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Corphita

USA . 2,159 parts In-Stock

1+ parts

$0.263

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2,159

$0.263

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Corohmni

South Africa . 456 parts In-Stock

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$0.292

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456

$0.292

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AZTECH Wire

Italy . 292 parts In-Stock

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$11.240

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292

$11.240

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Continental Prestige Electronics

USA . 74,748 parts In-Stock

1+ parts

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100+ parts

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$0.254

10k+ parts

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74,748

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$0.254

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TANS Electronics

Latvia . 8,157 parts In-Stock

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8,157

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Problanco Electronics

Mexico . 6,593 parts In-Stock

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6,593

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Kulean Microsystems

USA . 5,628 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,301 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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SupplyDigital Components

Austria . 1,081 parts In-Stock

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UHIMA Technologies

Türkiye . 731 parts In-Stock

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731

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Microchip USA

USA . 296 parts In-Stock

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296

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Overview

Enhance your electronic projects with the high-quality MC74HC04AFELG Logic Gates by Onsemi. Designed for reliability and precision, this product offers a seamless integration into your circuits, ensuring optimal performance. With applications in various industries, these logic gates provide versatility and efficiency. Experience the value of quick propagation delay, low power consumption, and ease of installation. Trust Onsemi's reputation for excellence and innovation to bring you the best in electronic components. Elevate your designs with the MC74HC04AFELG Logic Gates today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Propagation Delay At Nominal Supply: 22 ns

The low propagation delay ensures quick response time, making the product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable, the product is easy to integrate into circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V, the product offers energy efficiency and compatibility with a wide range of systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand harsh environmental conditions and ensures reliable performance.

Technology: CMOS

Utilizing CMOS technology, the product offers low power consumption, high noise immunity, and compatibility with various logic families.

Technical Specifications

Logic Gates MC74HC04AFELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74HC04AFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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