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MC74HC00AFELG

Onsemi

MC74HC00AFELG by Onsemi

MC74HC00AFELG by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It has a propagation delay of 22 ns at Vsup of 3V, suitable for military-grade applications due to its operating temperature range of -55 to 125 °C. This surface-mount package features a small outline design with dual-position terminals.

Median Price

$0.379

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 40,574 parts In-Stock

1+ parts

-

100+ parts

$0.357

1k+ parts

$0.296

10k+ parts

$0.264

40,574

-

$0.357

$0.296

$0.264

Verical

USA . 23,525 parts In-Stock

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$0.401

10k+ parts

$0.330

23,525

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-

$0.401

$0.330

Distributors (In-Stock)

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Digiode

USA . 2,112 parts In-Stock

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$0.277

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2,112

$0.277

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Vyrian

USA . 5,488 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,373 parts In-Stock

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$0.263

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1,373

$0.263

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Corohmni

South Africa . 94 parts In-Stock

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$0.292

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94

$0.292

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Component Stockers USA

USA . 42,381 parts In-Stock

1+ parts

$0.300

100+ parts

$0.280

1k+ parts

$0.260

10k+ parts

$0.260

42,381

$0.300

$0.280

$0.260

$0.260

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$11.694

100+ parts

$10.642

1k+ parts

$9.589

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-

3,000

$11.694

$10.642

$9.589

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AZTECH Wire

Italy . 1,183 parts In-Stock

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$18.220

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$18.220

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Continental Prestige Electronics

USA . 40,574 parts In-Stock

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$0.254

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40,574

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TANS Electronics

Latvia . 6,075 parts In-Stock

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Problanco Electronics

Mexico . 4,152 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,994 parts In-Stock

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SupplyDigital Components

Austria . 1,305 parts In-Stock

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Kulean Microsystems

USA . 1,151 parts In-Stock

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UHIMA Technologies

Türkiye . 921 parts In-Stock

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Kepictronics

USA . 906 parts In-Stock

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Microchip USA

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Overview

Unlock the power of efficient logic gates with the MC74HC00AFELG by Onsemi. Made with high-quality materials and advanced technology, this product offers reliability and precision in every application. Ideal for a wide range of electronic projects, this logic gate provides fast propagation delays and low power consumption, making it a cost-effective solution for your needs. Trust in Onsemi's reputation for excellence and elevate your designs with the MC74HC00AFELG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Propagation Delay At Nominal Supply: 22 ns

The low propagation delay ensures speedy processing of signals, making it suitable for time-sensitive applications.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving space and simplifying assembly.

No. of Functions: 4

With 4 functions in one package, it offers versatility and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes it compatible with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance ensures fast switching speeds and efficient performance.

Power Supplies (V): 2/6

Support for power supplies ranging from 2V to 6V provides flexibility in various applications.

Maximum Operating Temperature: 125 °C

Ability to operate at high temperatures makes it suitable for industrial and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable connections.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Logic Gates MC74HC00AFELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74HC00AFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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