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MC74ACT86DR2G

Onsemi

MC74ACT86DR2G by Onsemi

MC74ACT86DR2G by Onsemi is a 4-function logic gate with 2 inputs. It operates at a supply voltage of 5V and has a propagation delay of 10.5ns. Suitable for industrial applications, this CMOS technology device comes in a small outline package with matte tin finish and dual terminal position.

Median Price

$0.203

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

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Mouser Electronics

USA . 3,251 parts In-Stock

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$0.340

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$0.179

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$0.150

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$0.138

3,251

$0.340

$0.179

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$0.138

DigiKey

USA . 3,046 parts In-Stock

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$0.340

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$0.178

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$0.150

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$0.138

3,046

$0.340

$0.178

$0.150

$0.138

Rochester

USA . 21,575 parts In-Stock

1+ parts

-

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$0.164

1k+ parts

$0.137

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$0.122

21,575

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$0.164

$0.137

$0.122

EBV Elektronik

Germany . 7,500 parts In-Stock

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Verical

USA . 6,798 parts In-Stock

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Arrow

USA . 5,000 parts In-Stock

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$0.130

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Chip1Stop

Japan . 3,950 parts In-Stock

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$0.242

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$0.232

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$0.229

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$0.229

Distributors (In-Stock)

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Digiode

USA . 1,086 parts In-Stock

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$0.127

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Flip Electronics

USA . 35,000 parts In-Stock

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NAC Semi

USA . 5,000 parts In-Stock

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$0.593

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$0.593

IBS Electronics

USA . 5,000 parts In-Stock

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$0.155

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Chip Stock

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Vyrian

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Bristol Electronics

USA . 3,349 parts In-Stock

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Dan-Mar Components

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ComSIT Distribution GmbH

Germany . 3,021 parts In-Stock

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Rebound Electronics

UK . 2,628 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,580 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,380 parts In-Stock

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Pegasus Components GmbH

Germany . 688 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 263 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,759 parts In-Stock

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$0.121

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Corohmni

South Africa . 404 parts In-Stock

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$0.134

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Component Stockers USA

USA . 42,651 parts In-Stock

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$0.230

42,651

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$0.230

Perfect Parts

USA . 104,708 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 7,300 parts In-Stock

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GreenTree Electronics

Israel . 7,221 parts In-Stock

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A-Z Elektronik GmbH

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Kulean Microsystems

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iodParts Technologies Inc.

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Problanco Electronics

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Lixinc

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Kepictronics

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SupplyDigital Components

Austria . 1,696 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,214 parts In-Stock

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UHIMA Technologies

Türkiye . 610 parts In-Stock

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Metaverse IC Inc.

Canada . 600 parts In-Stock

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Overview

Enhance your electronic projects with the MC74ACT86DR2G by Onsemi! This high-quality logic gate offers reliable performance and precision, thanks to Onsemi's reputation for excellence in semiconductor manufacturing. Ideal for a wide range of applications, this logic gate provides customers with value and efficiency, making it a top choice for those seeking quality components. Upgrade your projects today with the MC74ACT86DR2G and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay at nominal supply voltage ensures fast response times, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation and assembly process easier and more efficient.

No. of Inputs: 2

Having 2 inputs allows for flexibility in logical operations, making the product versatile for different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes it compatible with a wide range of systems and components.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environments and extended use without overheating.

Technical Specifications

Logic Gates MC74ACT86DR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC74ACT86DR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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