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MC74ACT257MELG

Onsemi

MC74ACT257MELG by Onsemi

MC74ACT257MELG by Onsemi is a 4-function multiplexer with 2 inputs, 8.5 ns propagation delay at 5V supply. It has a small outline package and operates in industrial temperature range. Ideal for applications requiring high-speed signal switching in compact designs.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,373 parts In-Stock

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Digiode

USA . 2,294 parts In-Stock

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AZTECH Wire

Italy . 112 parts In-Stock

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$19.320

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SupplyDigital Components

Austria . 6,649 parts In-Stock

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Problanco Electronics

Mexico . 4,450 parts In-Stock

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Kulean Microsystems

USA . 4,064 parts In-Stock

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TANS Electronics

Latvia . 3,702 parts In-Stock

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Corphita

USA . 1,299 parts In-Stock

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UHIMA Technologies

Türkiye . 841 parts In-Stock

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Microchip USA

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Corohmni

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Overview

Discover the MC74ACT257MELG by Onsemi, a top-quality multiplexer & demultiplexer designed to meet your needs with precision and reliability. With a focus on innovative technology and industrial-grade materials, Onsemi ensures superior performance in a compact package. Ideal for a wide range of applications, this product offers seamless integration, efficiency, and optimal output characteristics. Experience the value of cutting-edge design and maximize your operations with the MC74ACT257MELG from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material provides good durability and protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 8.5 ns

The low propagation delay of 8.5 ns ensures fast data processing and transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation and integration of this multiplexer/demultiplexer easier and more convenient.

No. of Functions: 4

Having 4 functions in one device provides versatility and flexibility in designing and implementing various circuit configurations.

No. of Inputs: 2

With 2 inputs, this multiplexer/demultiplexer can effectively handle data selection and distribution tasks in electronic systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and reduces the need for additional voltage regulation.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF helps in stabilizing the signal transmission and maintaining signal integrity within the circuit.

Power Supplies (V): 5

Having a power supply voltage of 5V simplifies the power management aspect and ensures consistent and reliable operation of the multiplexer/demultiplexer.

No. of Terminals: 16

The 16 terminals provide ample connectivity options for integrating this multiplexer/demultiplexer into various circuit configurations.

Maximum I (ol): 24 Amp

The high output current of 24 Amp allows this device to drive multiple loads without compromising performance or stability.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide an additional level of control over the output signals, allowing for efficient signal routing and management.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures that this multiplexer/demultiplexer can withstand harsh environmental conditions and operate reliably in industrial settings.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this product energy-efficient and reliable for various applications.

Technical Specifications

Multiplexer & Demultiplexer MC74ACT257MELG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74ACT257MELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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