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MC74ACT04NG

Onsemi

MC74ACT04NG by Onsemi

MC74ACT04NG by Onsemi is a CMOS Logic Gates IC with 6 functions, 9ns propagation delay at 5V. It has a max operating temperature of 85 °C and is ideal for industrial applications requiring fast signal processing in a through-hole package.

Median Price

$0.292

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 12,541 parts In-Stock

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-

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$0.304

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$0.252

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$0.225

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$0.304

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$0.225

Verical

USA . 3,206 parts In-Stock

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$0.281

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$0.281

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Digiode

USA . 1,074 parts In-Stock

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$0.237

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DigiKey Marketplace

USA . 12,541 parts In-Stock

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Vyrian

USA . 5,732 parts In-Stock

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Prism Electronics

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Corphita

USA . 436 parts In-Stock

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$0.224

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Corohmni

South Africa . 462 parts In-Stock

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$0.249

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AZTECH Wire

Italy . 1,122 parts In-Stock

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$18.380

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Continental Prestige Electronics

USA . 12,541 parts In-Stock

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$0.216

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SupplyDigital Components

Austria . 8,232 parts In-Stock

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Kulean Microsystems

USA . 8,018 parts In-Stock

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Problanco Electronics

Mexico . 7,178 parts In-Stock

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Perfect Parts

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TANS Electronics

Latvia . 855 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 87 parts In-Stock

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Overview

Enhance your electronic projects with the MC74ACT04NG logic gate from Onsemi. Known for its superior quality and reliability, Onsemi offers a wide range of applications for their logic gates, making them essential components for any circuit design. With fast propagation delay and low power consumption, this product delivers exceptional performance while maintaining high efficiency. Trust Onsemi to provide you with the tools you need to bring your designs to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 9 ns

The low propagation delay ensures fast processing of signals in the logic gates, making them suitable for high-speed applications.

No. of Functions: 6

Having 6 functions in one device allows for complex logic operations to be performed efficiently without the need for multiple separate components.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes the logic gates compatible with a wide range of electronic systems and components.

Load Capacitance (CL): 50 pF

The load capacitance value ensures stable performance and reliable operation of the logic gates in various circuit configurations.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the logic gates can withstand elevated temperatures and harsh environmental conditions.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity in the operation of the logic gates.

Technical Specifications

Logic Gates MC74ACT04NG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

ACT

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC74ACT04NG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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