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MC10H164MEL

Onsemi

MC10H164MEL by Onsemi

MC10H164MEL by Onsemi is a multiplexer with 8 inputs and 16 terminals. It offers a propagation delay of 2.5 ns at nominal supply, suitable for high-speed applications. With a small outline package style and surface mount capability, it is ideal for commercial extended temperature grade ECL technology projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,800 parts In-Stock

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5,800

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Digiode

USA . 1,174 parts In-Stock

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1,174

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Distributors (Availability)

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AZTECH Wire

Italy . 1,203 parts In-Stock

1+ parts

$12.660

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1,203

$12.660

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Kulean Microsystems

USA . 7,976 parts In-Stock

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Problanco Electronics

Mexico . 7,593 parts In-Stock

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SupplyDigital Components

Austria . 5,414 parts In-Stock

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5,414

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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TANS Electronics

Latvia . 1,460 parts In-Stock

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1,460

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Corphita

USA . 891 parts In-Stock

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891

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Microchip USA

USA . 368 parts In-Stock

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Corohmni

South Africa . 127 parts In-Stock

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UHIMA Technologies

Türkiye . 122 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the MC10H164MEL by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in every product they offer. The MC10H164MEL falls under the category of Multiplexer & Demultiplexer, providing versatile solutions for a wide range of applications. With its fast propagation delay and high-performance output characteristics, this product offers unparalleled value and benefits to customers looking for efficient and reliable multiplexing solutions. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 2.6 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer offers versatility in connecting multiple input sources, making it suitable for complex systems.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the PCB, saving valuable real estate in compact electronic designs.

No. of Terminals: 16

With 16 terminals, this product offers ample connectivity options, making it versatile for various application requirements.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for densely populated board layouts in electronic devices.

Propagation Delay (tpd): 2.5 ns

Low propagation delay of 2.5 ns ensures minimal signal distortion and fast switching speeds, ideal for high-frequency applications.

Maximum Operating Temperature: 75 °C

High maximum operating temperature of 75 °C allows for reliable performance in a wide range of environmental conditions.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristics provide flexibility in connecting external components, enhancing the product's compatibility with various circuit configurations.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0 °C ensures the product can operate in colder environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers excellent corrosion resistance and ensures reliable electrical connections for long-term performance.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in circuit connections, enhancing the product's reliability and ease of integration.

Maximum Seated Height: 2.05 mm

Low maximum seated height of 2.05 mm allows for compact and low-profile PCB designs, suitable for space-constrained applications.

Width: 5.275 mm

Narrow width of 5.275 mm saves space on the PCB and allows for efficient board layout in electronic systems.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with other components in the circuit, reducing the risk of errors or signal misinterpretation.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260 °C ensures reliable soldering during PCB assembly, minimizing the risk of solder joint failures.

Length: 10.2 mm

Compact length of 10.2 mm saves space on the PCB and allows for densely populated electronic designs with multiple components.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures the product can operate reliably in a wide range of temperature conditions, making it suitable for various commercial applications.

Technology: ECL

ECL technology offers high-speed performance with low power consumption, making this product ideal for applications requiring efficient signal processing and high-speed communication.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and reliable solder connections, enhancing the product's durability and long-term performance.

Packing Method: TR

TR packing method ensures secure packaging and protection of the product during shipping and handling, reducing the risk of damage or contamination.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product offers compatibility with standard PCB layouts and allows for easy integration into existing electronic designs.

Maximum Power Supply Current (ICC): 83 mA

With a maximum power supply current of 83 mA, this product consumes low power, making it energy-efficient and suitable for battery-operated devices or power-sensitive applications.

Technical Specifications

Multiplexer & Demultiplexer MC10H164MEL attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

83 mA

Propagation Delay At Nominal Supply:

2.6 ns

Propagation Delay (tpd):

2.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H164MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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