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MC10H107M

Onsemi

MC10H107M by Onsemi

MC10H107M by Onsemi is a Logic Gates IC with 3 functions and 2 inputs. It has a fast propagation delay of 1.6 ns at -5.2V, suitable for high-speed applications in commercial extended temperature range. The small outline package with gull wing terminals makes it ideal for surface mount PCB designs.

Median Price

$1.380

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$1.490

1k+ parts

$1.240

10k+ parts

$1.100

600

-

$1.490

$1.240

$1.100

DigiKey

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.270

10k+ parts

$1.270

600

-

-

$1.270

$1.270

Farnell

UK . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.240

10k+ parts

-

600

-

-

$1.240

-

Verical

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.550

10k+ parts

$1.375

600

-

-

$1.550

$1.375

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,461 parts In-Stock

1+ parts

$1.226

100+ parts

-

1k+ parts

-

10k+ parts

-

1,461

$1.226

-

-

-

Vyrian

USA . 6,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,358

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 589 parts In-Stock

1+ parts

$1.161

100+ parts

-

1k+ parts

-

10k+ parts

-

589

$1.161

-

-

-

Component Stockers USA

USA . 714 parts In-Stock

1+ parts

$1.230

100+ parts

$1.160

1k+ parts

-

10k+ parts

-

714

$1.230

$1.160

-

-

Corohmni

South Africa . 66 parts In-Stock

1+ parts

$1.240

100+ parts

-

1k+ parts

-

10k+ parts

-

66

$1.240

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,537 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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26,537

-

-

-

-

Problanco Electronics

Mexico . 7,678 parts In-Stock

1+ parts

-

100+ parts

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7,678

-

-

-

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SupplyDigital Components

Austria . 5,232 parts In-Stock

1+ parts

-

100+ parts

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5,232

-

-

-

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Microchip USA

USA . 4,991 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,991

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-

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TANS Electronics

Latvia . 4,241 parts In-Stock

1+ parts

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100+ parts

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4,241

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-

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Kulean Microsystems

USA . 1,880 parts In-Stock

1+ parts

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100+ parts

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1,880

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Metaverse IC Inc.

Canada . 885 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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885

-

-

-

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Continental Prestige Electronics

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$1.060

1k+ parts

-

10k+ parts

-

600

-

$1.060

-

-

UHIMA Technologies

Türkiye . 483 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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483

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-

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Kepictronics

USA . 378 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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378

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-

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Perfect Parts

USA . 245 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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245

-

-

-

-

Overview

Experience unparalleled quality and reliability with the MC10H107M by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge logic gates like this one, perfect for a wide range of applications. With its fast propagation delay and small outline package style, this product offers customers exceptional value and benefits. Trust Onsemi to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the MC10H107M today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material allows for a lightweight and durable package, making it suitable for various applications.

Propagation Delay At Nominal Supply: 1.7 ns

The low propagation delay ensures fast signal processing and responsiveness in electronic circuits.

Surface Mount: YES

Being surface mountable simplifies the PCB assembly process and saves space on the board.

No. of Functions: 3

Multiple functions in a single package offer versatility in circuit design and integration.

No. of Inputs: 2

Having 2 inputs allows for basic logic operations to be performed efficiently.

Nominal Supply Voltage / Vsup (V): -5.2

Operating at a nominal voltage of -5.2V makes it compatible with standard power supplies and logic levels.

No. of Terminals: 16

Having multiple terminals provides flexibility in connecting the logic gate to other components in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the PCB and is suitable for compact electronic devices.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75 °C, the logic gate can function reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at 0 °C ensures functionality in cold environments without compromising performance.

Technical Specifications

Logic Gates MC10H107M attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

No. of Functions:

3

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1.7 ns

Propagation Delay (tpd):

1.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H107M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-461-6375, 5962014616375

NIIN

014616375

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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