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MC10H104MEL

Onsemi

MC10H104MEL by Onsemi

MC10H104MEL by Onsemi is a Logic Gate with 4 functions, 2 inputs, and propagation delay of 1.75 ns. It operates at -5.2V, has a temp range of 0-75 °C, and uses ECL technology. Ideal for applications requiring fast signal processing in compact electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,562 parts In-Stock

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Digiode

USA . 2,478 parts In-Stock

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AZTECH Wire

Italy . 885 parts In-Stock

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Kulean Microsystems

USA . 2,695 parts In-Stock

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Problanco Electronics

Mexico . 2,263 parts In-Stock

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Corphita

USA . 2,114 parts In-Stock

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Kepictronics

USA . 1,212 parts In-Stock

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SupplyDigital Components

Austria . 1,020 parts In-Stock

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TANS Electronics

Latvia . 512 parts In-Stock

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Corohmni

South Africa . 406 parts In-Stock

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UHIMA Technologies

Türkiye . 337 parts In-Stock

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Microchip USA

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Overview

Unleash the power of cutting-edge technology with the MC10H104MEL from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality logic gates that are versatile and reliable. Ideal for a wide range of applications, this product boasts fast propagation delay, high performance, and easy surface mount installation. Experience unparalleled efficiency and accuracy in your projects with the MC10H104MEL, providing superior value and benefits to customers seeking top-notch components for their electronic systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 1.9 ns

With a low propagation delay, this logic gate operates quickly, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

No. of Functions: 4

Having multiple functions in a single package increases functionality and versatility, making it a cost-effective solution.

No. of Inputs: 2

With 2 inputs, this logic gate can perform basic logical operations efficiently and accurately.

Nominal Supply Voltage / Vsup (V): -5.2

Operating at a nominal supply voltage of -5.2V provides reliable and stable performance in various electrical systems.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and configurations, enhancing the versatility and usability of the product.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact electronic devices.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, this logic gate can withstand a wide range of environmental conditions and applications.

Technology: ECL

Utilizing Emitter-Coupled Logic technology ensures high-speed performance and low power consumption, making it an efficient choice for various applications.

Technical Specifications

Logic Gates MC10H104MEL attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1.9 ns

Propagation Delay (tpd):

1.75 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H104MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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