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SN74LVC1G08DBVTG4

Texas Instruments

SN74LVC1G08DBVTG4 by Texas Instruments

SN74LVC1G08DBVTG4 by Texas Instruments is a CMOS logic gate with 2 inputs, 5 terminals, and a propagation delay of 8 ns at 3.3V. It operates in the temperature range of -40 to 125°C, making it suitable for automotive applications requiring fast signal processing in compact spaces. With a small outline package style and low power consumption of 0.01 mA, it is ideal for surface mount designs with limited space constraints.

Median Price

$0.443

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 7,028 parts In-Stock

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$0.434

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$0.363

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$0.363

Arrow

USA . 1,000 parts In-Stock

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$0.452

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$0.452

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$0.640

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50

$0.640

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Chip Stock

USA . 261,580 parts In-Stock

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Vyrian

USA . 6,635 parts In-Stock

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Digiode

USA . 4,251 parts In-Stock

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Contempo Components LLC

USA . 285 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 7,012 parts In-Stock

1+ parts

$0.369

100+ parts

$0.360

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$0.358

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-

7,012

$0.369

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$0.358

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Aranea Global

USA . 100 parts In-Stock

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$0.627

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$0.602

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100

$0.627

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Argo Parts USA

USA . 4,332 parts In-Stock

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$0.640

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$0.621

4,332

$0.640

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Continental Prestige Electronics

USA . 413 parts In-Stock

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$0.640

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$0.627

413

$0.640

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$0.627

Ampacity Inc.

Singapore . 6,618 parts In-Stock

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$0.800

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$0.800

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Advanced Electronics

New Zealand . 28 parts In-Stock

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$18.093

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$17.188

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Parana Technologies

USA . 987 parts In-Stock

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$20.237

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DigiPath Technology Company

USA . 2,234 parts In-Stock

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$22.283

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ChromeModa Solutions

Germany . 2,397 parts In-Stock

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$22.738

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$18.645

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IDEA Electronic Components Group

UK . 1,244 parts In-Stock

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$22.738

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$21.601

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$20.464

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Corohmni

South Africa . 919 parts In-Stock

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$32.025

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QUARKTWIN TECHNOLOGY LTD

USA . 14,518 parts In-Stock

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Corphita

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Microchip USA

USA . 2,403 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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Perfect Parts

USA . 196 parts In-Stock

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Overview

Unlock the power of seamless logic with the SN74LVC1G08DBVTG4 by Texas Instruments. As a leader in innovation, Texas Instruments delivers top-quality products like this logic gate designed for optimal performance in various applications. Experience lightning-fast propagation delay and reliable operation with a nominal supply voltage of 3.3V. With its compact design and high reliability, this logic gate is perfect for automotive and industrial applications. Trust Texas Instruments for cutting-edge technology that delivers value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this logic gate lightweight and durable, ideal for various applications.

Propagation Delay At Nominal Supply: 4.5 ns

With a fast propagation delay, this logic gate ensures quick signal processing, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of this logic gate onto circuit boards.

No. of Inputs: 2

Having 2 inputs offers flexibility in designing logic circuits, making this product versatile and adaptable.

Package Shape: RECTANGULAR

The rectangular shape of the package provides efficient use of space on a circuit board, making it a practical choice.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources, making this logic gate easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this logic gate can effectively drive capacitive loads, making it suitable for complex circuits.

Power Supplies (V): 3.3

The ability to operate at a power supply voltage of 3.3V provides energy efficiency and compatibility with a wide range of systems.

No. of Terminals: 5

Having 5 terminals simplifies the connection of this logic gate within a circuit, making it user-friendly and efficient.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style offers space-saving benefits and enhances the overall compactness of the circuit design.

Maximum I (ol): 24 Amp

With a maximum output current of 24 Amp, this logic gate can drive high loads, making it suitable for demanding applications.

Propagation Delay (tpd): 8 ns

The propagation delay of 8 ns ensures quick signal processing and efficient logic operation, making this product reliable for time-critical applications.

Technical Specifications

Logic Gates SN74LVC1G08DBVTG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

SN74LVC1G08DBVTG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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