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MC10EP57DT

Onsemi

MC10EP57DT by Onsemi

MC10EP57DT by Onsemi is a 4-input multiplexer with 0.52 ns propagation delay at 3.3V. It operates in industrial temperature range (-40 to 85 °C) and supports ECL technology. With small outline package, it's ideal for high-speed signal switching applications.

Median Price

$8.348

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,175 parts In-Stock

1+ parts

-

100+ parts

$7.420

1k+ parts

$6.640

10k+ parts

$6.250

5,175

-

$7.420

$6.640

$6.250

Verical

USA . 5,175 parts In-Stock

1+ parts

-

100+ parts

$9.275

1k+ parts

$8.300

10k+ parts

$7.813

5,175

-

$9.275

$8.300

$7.813

Distributors (In-Stock)

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Digiode

USA . 242 parts In-Stock

1+ parts

$7.856

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242

$7.856

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Vyrian

USA . 8,580 parts In-Stock

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8,580

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Electronic Expediters

USA . 116 parts In-Stock

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Bristol Electronics

USA . 56 parts In-Stock

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56

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Legend Electronics Inc.

USA . 45 parts In-Stock

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45

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PC Components Company LLC

USA . 28 parts In-Stock

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Prism Electronics

USA . 23 parts In-Stock

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Microfarads

USA . 19 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 468 parts In-Stock

1+ parts

$7.150

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468

$7.150

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Corphita

USA . 685 parts In-Stock

1+ parts

$7.443

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685

$7.443

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AZTECH Wire

Italy . 853 parts In-Stock

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$19.220

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853

$19.220

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Continental Prestige Electronics

USA . 5,175 parts In-Stock

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TANS Electronics

Latvia . 5,154 parts In-Stock

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SupplyDigital Components

Austria . 4,068 parts In-Stock

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Kulean Microsystems

USA . 1,521 parts In-Stock

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Problanco Electronics

Mexico . 979 parts In-Stock

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979

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Perfect Parts

USA . 353 parts In-Stock

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Microchip USA

USA . 214 parts In-Stock

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UHIMA Technologies

Türkiye . 93 parts In-Stock

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93

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Overview

Upgrade your electronic designs with the MC10EP57DT by Onsemi. This high-quality multiplexer offers unparalleled performance and reliability, thanks to Onsemi's reputation for excellence in manufacturing. Ideal for a variety of applications, this multiplexer provides fast signal switching and precise data transmission. Experience the value and benefits of choosing Onsemi's MC10EP57DT for your next project, and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to physical damage, making this product suitable for rugged environments.

Propagation Delay At Nominal Supply: 0.52 ns

With a fast propagation delay, this multiplexer provides quick switching between inputs, improving overall system efficiency.

Surface Mount: YES

Being surface mountable makes installation and integration of this multiplexer easier and more compact compared to through-hole components.

No. of Inputs: 4

Having 4 inputs allows for versatility in input sources, making this multiplexer suitable for various applications that require multiple inputs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V provides compatibility with common voltage standards, making integration into existing systems seamless.

Minimum Supply Voltage (Vsup): 3 V

The ability to operate at a minimum supply voltage of 3V allows for flexibility in power sources and extends the range of applications this multiplexer can be used in.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this multiplexer can perform reliably in environments with elevated temperatures, ensuring consistent operation.

Technology: ECL

Utilizing ECL technology offers high-speed operation and low power consumption, making this multiplexer efficient and suitable for high-performance applications.

Technical Specifications

Multiplexer & Demultiplexer MC10EP57DT attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V;

Family:

10E

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

65 mA

Propagation Delay At Nominal Supply:

.52 ns

Propagation Delay (tpd):

.475 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC10EP57DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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