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MC10EL58DG

Onsemi

MC10EL58DG by Onsemi

MC10EL58DG by Onsemi is a 2-input multiplexer with 0.34 ns propagation delay at 5V. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package style. Ideal for high-speed communication systems requiring fast signal switching.

Median Price

$3.915

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 568 parts In-Stock

1+ parts

$3.020

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568

$3.020

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Chip1Stop

Japan . 1 parts In-Stock

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$4.020

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1

$4.020

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Flip Electronics (Authorized)

USA . 26,314 parts In-Stock

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26,314

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DigiKey

USA . 23,664 parts In-Stock

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$3.810

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23,664

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$3.810

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Verical

USA . 228 parts In-Stock

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228

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Rochester

USA . 63 parts In-Stock

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$4.110

1k+ parts

$3.680

10k+ parts

$3.460

63

-

$4.110

$3.680

$3.460

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Greenchips

USA . 500 parts In-Stock

1+ parts

$2.895

100+ parts

$2.523

1k+ parts

$2.488

10k+ parts

$2.478

500

$2.895

$2.523

$2.488

$2.478

Digiode

USA . 1,124 parts In-Stock

1+ parts

$4.123

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1,124

$4.123

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Flip Electronics

USA . 26,164 parts In-Stock

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Vyrian

USA . 4,946 parts In-Stock

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4,946

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Bristol Electronics

USA . 1,960 parts In-Stock

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1,960

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SIE Connect GmbH - GreenChips

Germany . 500 parts In-Stock

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500

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Semtec, LLC

USA . 174 parts In-Stock

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174

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Distributors (Availability)

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Corohmni

South Africa . 287 parts In-Stock

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$3.160

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287

$3.160

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Corphita

USA . 1,012 parts In-Stock

1+ parts

$3.906

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1,012

$3.906

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Component Stockers USA

USA . 765 parts In-Stock

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$4.700

100+ parts

$4.360

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765

$4.700

$4.360

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Ampacity Inc.

Singapore . 3,608 parts In-Stock

1+ parts

$7.440

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3,608

$7.440

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Microchip USA

USA . 2,303 parts In-Stock

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$23.324

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2,303

$23.324

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TANS Electronics

Latvia . 7,059 parts In-Stock

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Problanco Electronics

Mexico . 5,546 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 4,934 parts In-Stock

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Kulean Microsystems

USA . 1,241 parts In-Stock

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Perfect Parts

USA . 382 parts In-Stock

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382

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Continental Prestige Electronics

USA . 63 parts In-Stock

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UHIMA Technologies

Türkiye . 62 parts In-Stock

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Overview

Experience top-of-the-line performance with the MC10EL58DG by Onsemi. Engineered with precision and expertise, this multiplexer & demultiplexer offers unparalleled quality and reliability. Ideal for a wide range of applications, this product delivers fast propagation delay, making it a valuable asset for your projects. With a nominal supply voltage of 5V and open-emitter output characteristics, the MC10EL58DG provides customers with exceptional value, efficiency, and functionality. Upgrade your electronics with this superior component from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that offers good protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay at Nominal Supply: 0.38 ns

Fast propagation delay ensures efficient data transmission without significant delays.

Surface Mount: YES

Easy to install and suitable for modern PCB designs.

No. of Inputs: 2

Sufficient number of inputs for basic multiplexing/demultiplexing needs.

Nominal Supply Voltage: 5V

Common voltage level for compatibility with a wide range of systems.

Minimum Operating Temperature: -40 °C

Can operate in harsh environments with low temperatures.

Maximum Operating Temperature: 85 °C

Can handle high temperatures without performance degradation.

Technology: ECL

Uses ECL technology which is known for high-speed operation and low power consumption.

Technical Specifications

Multiplexer & Demultiplexer MC10EL58DG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.7 V WITH VCC = 0 V

Family:

10EL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

17 mA

Propagation Delay At Nominal Supply:

.38 ns

Propagation Delay (tpd):

.34 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10EL58DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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