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MC10EL07DG

Onsemi

MC10EL07DG by Onsemi

MC10EL07DG by Onsemi is a logic gate with 2 inputs, 0.395 ns propagation delay, and 5V nominal voltage. Ideal for industrial applications, it operates b/w -40 to 85 °C temperature range and has a small outline package style.

Median Price

$2.969

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 46,412 parts In-Stock

1+ parts

-

100+ parts

$2.800

1k+ parts

$2.510

10k+ parts

$2.360

46,412

-

$2.800

$2.510

$2.360

Verical

USA . 19,007 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.138

10k+ parts

$2.950

19,007

-

-

$3.138

$2.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,038 parts In-Stock

1+ parts

$2.964

100+ parts

-

1k+ parts

-

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-

2,038

$2.964

-

-

-

Vyrian

USA . 2,882 parts In-Stock

1+ parts

-

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2,882

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,178 parts In-Stock

1+ parts

$2.808

100+ parts

-

1k+ parts

-

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1,178

$2.808

-

-

-

Corohmni

South Africa . 66 parts In-Stock

1+ parts

$3.120

100+ parts

-

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66

$3.120

-

-

-

AZTECH Wire

Italy . 1,067 parts In-Stock

1+ parts

$12.350

100+ parts

-

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10k+ parts

-

1,067

$12.350

-

-

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Continental Prestige Electronics

USA . 46,497 parts In-Stock

1+ parts

-

100+ parts

$2.710

1k+ parts

-

10k+ parts

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46,497

-

$2.710

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TANS Electronics

Latvia . 7,317 parts In-Stock

1+ parts

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7,317

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Microchip USA

USA . 7,018 parts In-Stock

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7,018

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Problanco Electronics

Mexico . 5,478 parts In-Stock

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5,478

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QUARKTWIN TECHNOLOGY LTD

USA . 3,395 parts In-Stock

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3,395

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SupplyDigital Components

Austria . 2,798 parts In-Stock

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2,798

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Kulean Microsystems

USA . 1,838 parts In-Stock

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1,838

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Perfect Parts

USA . 461 parts In-Stock

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461

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UHIMA Technologies

Türkiye . 85 parts In-Stock

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85

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Overview

Enhance your electronic designs with the MC10EL07DG logic gate by Onsemi. Known for their superior quality and reliability, Onsemi products are trusted by industry professionals worldwide. The MC10EL07DG is perfect for applications requiring fast signal processing, thanks to its low propagation delay of only 0.395 ns. With a small outline package style and dual terminal position, this logic gate is ideal for space-constrained projects. Trust Onsemi to deliver top-notch performance and efficiency with the MC10EL07DG. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability, making it a suitable choice for various industrial applications.

Propagation Delay At Nominal Supply: 0.435 ns

Low propagation delay ensures faster processing speed and efficient operation of the logic gate.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on printed circuit boards.

No. of Inputs: 2

Having two inputs offers flexibility in logic operations and allows for more complex circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage of 5V ensures compatibility with commonly used power sources in electronics.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures ensures functionality even in extreme cold temperatures.

Terminal Finish: TIN

Tin terminal finish offers good conductivity and solderability, enhancing the overall performance of the logic gate.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for efficient soldering and assembly processes during manufacturing.

Technical Specifications

Logic Gates MC10EL07DG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC =0V WITH VEE = -4.2V TO -5.7V

Family:

10EL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

17 mA

Propagation Delay At Nominal Supply:

.435 ns

Propagation Delay (tpd):

.395 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10EL07DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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