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MC10E157FNR2G

Onsemi

MC10E157FNR2G by Onsemi

MC10E157FNR2G by Onsemi is a 4-function, 2-input multiplexer with 0.55 ns propagation delay at 5V. It operates in the temperature range of 0-85 °C and has a terminal pitch of 1.27mm. Ideal for high-speed data communication systems requiring fast signal switching.

Median Price

$3.858

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$3.430

1k+ parts

$3.070

10k+ parts

$2.890

1,000

-

$3.430

$3.070

$2.890

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$4.287

1k+ parts

$3.837

10k+ parts

$3.612

1,000

-

$4.287

$3.837

$3.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 350 parts In-Stock

1+ parts

$3.629

100+ parts

-

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350

$3.629

-

-

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Vyrian

USA . 4,029 parts In-Stock

1+ parts

-

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4,029

-

-

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Cyclops Electronics Ltd

UK . 442 parts In-Stock

1+ parts

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442

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Distributors (Availability)

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Corohmni

South Africa . 479 parts In-Stock

1+ parts

$3.300

100+ parts

-

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479

$3.300

-

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Corphita

USA . 175 parts In-Stock

1+ parts

$3.438

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-

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175

$3.438

-

-

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AZTECH Wire

Italy . 1,059 parts In-Stock

1+ parts

$16.970

100+ parts

-

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1,059

$16.970

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SupplyDigital Components

Austria . 8,217 parts In-Stock

1+ parts

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8,217

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QUARKTWIN TECHNOLOGY LTD

USA . 8,149 parts In-Stock

1+ parts

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8,149

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Kulean Microsystems

USA . 5,623 parts In-Stock

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5,623

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TANS Electronics

Latvia . 4,590 parts In-Stock

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4,590

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Continental Prestige Electronics

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$3.300

1k+ parts

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1,000

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$3.300

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Perfect Parts

USA . 874 parts In-Stock

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874

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Metaverse IC Inc.

Canada . 542 parts In-Stock

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542

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Microchip USA

USA . 457 parts In-Stock

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457

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Problanco Electronics

Mexico . 307 parts In-Stock

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307

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UHIMA Technologies

Türkiye . 115 parts In-Stock

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115

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Overview

Experience top-notch performance with the MC10E157FNR2G by Onsemi. As a leading manufacturer, Onsemi ensures only the highest quality products are delivered to customers. This multiplexer & demultiplexer offers unparalleled speed and precision, making it ideal for a wide range of applications. From telecommunications to data communications, this product provides reliable operation and seamless integration. Trust Onsemi to provide innovative solutions that exceed expectations and drive success in your projects. Choose the MC10E157FNR2G for unmatched value and performance in your next design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the multiplexer/demultiplexer, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 0.55 ns

Low propagation delay ensures fast processing and efficient operation of the multiplexer/demultiplexer, making it suitable for high-speed applications.

No. of Functions: 4

Having 4 functions in one device allows for versatile signal routing and management capabilities, increasing the flexibility of the product.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes integration into existing circuits easier and more convenient.

Technology: ECL

ECL technology offers high speed and low power consumption, making the multiplexer/demultiplexer efficient and suitable for demanding applications.

Technical Specifications

Multiplexer & Demultiplexer MC10E157FNR2G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.7 V WITH VCC = 0 V

Family:

10E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

.55 ns

Propagation Delay (tpd):

.55 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10E157FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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