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MC100LVEL58DTG

Onsemi

MC100LVEL58DTG by Onsemi

MC100LVEL58DTG by Onsemi is a 2-input multiplexer with 0.59 ns propagation delay at 3.3V. Operating b/w -40 to 85 °C, it has a small outline package and GULL WING terminals suitable for industrial applications requiring fast signal switching.

Median Price

$3.130

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 81 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

81

-

$3.130

$2.800

$2.630

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 848 parts In-Stock

1+ parts

$3.306

100+ parts

-

1k+ parts

-

10k+ parts

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848

$3.306

-

-

-

Vyrian

USA . 8,457 parts In-Stock

1+ parts

-

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8,457

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-

-

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Semi Source

USA . 57 parts In-Stock

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57

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5 parts In-Stock

1+ parts

$2.960

100+ parts

-

1k+ parts

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5

$2.960

-

-

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Corphita

USA . 374 parts In-Stock

1+ parts

$3.132

100+ parts

-

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374

$3.132

-

-

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Corohmni

South Africa . 410 parts In-Stock

1+ parts

$3.480

100+ parts

-

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10k+ parts

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410

$3.480

-

-

-

Component Stockers USA

USA . 116 parts In-Stock

1+ parts

$3.540

100+ parts

-

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-

116

$3.540

-

-

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AZTECH Wire

Italy . 52 parts In-Stock

1+ parts

$19.200

100+ parts

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52

$19.200

-

-

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TANS Electronics

Latvia . 7,837 parts In-Stock

1+ parts

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7,837

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SupplyDigital Components

Austria . 5,740 parts In-Stock

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5,740

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Microchip USA

USA . 4,450 parts In-Stock

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4,450

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Kulean Microsystems

USA . 4,018 parts In-Stock

1+ parts

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4,018

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Problanco Electronics

Mexico . 2,370 parts In-Stock

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2,370

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UHIMA Technologies

Türkiye . 965 parts In-Stock

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965

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Overview

Enhance your electronic designs with the MC100LVEL58DTG by Onsemi, a high-quality Multiplexer & Demultiplexer that delivers exceptional performance and reliability. With a fast propagation delay of 0.59 ns and a compact square package shape, this product is perfect for a wide range of applications. From telecommunications to industrial automation, this versatile device offers customers unmatched value and benefits. Trust in Onsemi's expertise and innovation to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 0.59 ns

Low propagation delay ensures fast data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Standard supply voltage ensures compatibility with commonly used power sources.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes this product suitable for use in various environments.

Technology: ECL

ECL (Emitter-Coupled Logic) technology provides high-speed performance and low power consumption, making this product efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer MC100LVEL58DTG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVEL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

.59 ns

Propagation Delay (tpd):

.57 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC100LVEL58DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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