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MC100LVEL58DR2G

Onsemi

MC100LVEL58DR2G by Onsemi

MC100LVEL58DR2G by Onsemi is a 2-input multiplexer with 0.57 ns propagation delay at 3.3V, ideal for industrial applications. With ECL technology and -40 to 85 °C operating range, it offers complementary output polarity in a small outline package. This surface-mount device has dual terminals and requires min 3V supply voltage.

Median Price

$3.522

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,750 parts In-Stock

1+ parts

-

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$3.130

1k+ parts

$2.800

10k+ parts

$2.630

9,750

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$3.130

$2.800

$2.630

Verical

USA . 9,750 parts In-Stock

1+ parts

-

100+ parts

$3.913

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$3.500

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9,750

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$3.913

$3.500

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Distributors (In-Stock)

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Digiode

USA . 466 parts In-Stock

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$3.306

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466

$3.306

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DigiKey Marketplace

USA . 9,950 parts In-Stock

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Vyrian

USA . 4,370 parts In-Stock

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Electronics Depot

USA . 1,195 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 47 parts In-Stock

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Distributors (Availability)

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Benley Electronics

USA . 25 parts In-Stock

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$0.450

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25

$0.450

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Corohmni

South Africa . 125 parts In-Stock

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$3.000

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125

$3.000

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Corphita

USA . 737 parts In-Stock

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$3.132

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737

$3.132

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AZTECH Wire

Italy . 379 parts In-Stock

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$20.670

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Continental Prestige Electronics

USA . 9,950 parts In-Stock

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$3.000

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Kulean Microsystems

USA . 8,189 parts In-Stock

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Microchip USA

USA . 7,406 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,525 parts In-Stock

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SupplyDigital Components

Austria . 2,997 parts In-Stock

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TANS Electronics

Latvia . 2,189 parts In-Stock

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UHIMA Technologies

Türkiye . 745 parts In-Stock

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Problanco Electronics

Mexico . 248 parts In-Stock

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Perfect Parts

USA . 105 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 47 parts In-Stock

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Overview

Unlock the power of high-performance data transmission with the MC100LVEL58DR2G by Onsemi. Crafted with precision and excellence, this multiplexer/demultiplexer offers unparalleled speed and reliability for your applications. Whether you're in telecommunications, networking, or industrial automation, this product delivers top-notch quality and efficiency. Experience seamless operation and superior performance with Onsemi's cutting-edge technology. Choose the MC100LVEL58DR2G for unmatched value and unbeatable advantages in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 0.59 ns

Low propagation delay allows for fast signal processing and improved efficiency.

Surface Mount: YES

Surface mount capability makes installation and circuit design convenient and space-saving.

No. of Inputs: 2

Having 2 inputs provides flexibility and compatibility with various input sources.

Nominal Supply Voltage / Vsup (V): 3.3

A stable supply voltage of 3.3V ensures consistent performance and reliability.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for operation in different environmental conditions.

Maximum Seated Height: 1.75 mm

Low seated height saves space and enables compact design layouts.

Output Polarity: COMPLEMENTARY

Complementary output polarity ensures efficient signal transmission and compatibility with other components.

Technology: ECL

ECL technology offers high-speed performance and low power consumption.

Technical Specifications

Multiplexer & Demultiplexer MC100LVEL58DR2G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVEL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

.59 ns

Propagation Delay (tpd):

.57 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC100LVEL58DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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