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MC100LVEL01DG

Onsemi

MC100LVEL01DG by Onsemi

MC100LVEL01DG by Onsemi is a logic gate with 4 inputs, 0.49 ns propagation delay at 3.3V, and -40 to 85°C operating temperature range. Ideal for high-speed applications in industrial settings due to ECL technology and small outline package style.

Median Price

$3.522

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24,055 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

24,055

-

$3.130

$2.800

$2.630

Verical

USA . 10,905 parts In-Stock

1+ parts

-

100+ parts

$3.913

1k+ parts

$3.500

10k+ parts

$3.288

10,905

-

$3.913

$3.500

$3.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,401 parts In-Stock

1+ parts

$3.306

100+ parts

-

1k+ parts

-

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-

2,401

$3.306

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$3.767

100+ parts

-

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-

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150

$3.767

-

-

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Vyrian

USA . 3,247 parts In-Stock

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3,247

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Distributors (Availability)

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Ampacity Inc.

Singapore . 22,388 parts In-Stock

1+ parts

$2.960

100+ parts

-

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-

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22,388

$2.960

-

-

-

Corphita

USA . 2,351 parts In-Stock

1+ parts

$3.132

100+ parts

-

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-

2,351

$3.132

-

-

-

Corohmni

South Africa . 419 parts In-Stock

1+ parts

$3.480

100+ parts

-

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10k+ parts

-

419

$3.480

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.767

100+ parts

-

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-

1,000

$3.767

-

-

-

AZTECH Wire

Italy . 541 parts In-Stock

1+ parts

$9.900

100+ parts

-

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541

$9.900

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QUARKTWIN TECHNOLOGY LTD

USA . 24,407 parts In-Stock

1+ parts

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24,407

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Continental Prestige Electronics

USA . 24,055 parts In-Stock

1+ parts

-

100+ parts

$3.010

1k+ parts

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24,055

-

$3.010

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Problanco Electronics

Mexico . 7,455 parts In-Stock

1+ parts

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7,455

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TANS Electronics

Latvia . 1,665 parts In-Stock

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1,665

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Kulean Microsystems

USA . 1,628 parts In-Stock

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1,628

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SupplyDigital Components

Austria . 611 parts In-Stock

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611

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Microchip USA

USA . 341 parts In-Stock

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341

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Speed Components Ltd (Excess)

Israel . 196 parts In-Stock

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196

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UHIMA Technologies

Türkiye . 132 parts In-Stock

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132

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Perfect Parts

USA . 1 parts In-Stock

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1

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Overview

Elevate your logic gate applications with the MC100LVEL01DG by Onsemi. Expertly crafted with high-quality materials and cutting-edge technology, this product offers unparalleled performance and reliability. With a fast propagation delay of 0.49 ns and a wide operating temperature range, this small outline package is perfect for industrial-grade projects. Explore the endless possibilities and maximize efficiency with the MC100LVEL01DG. Upgrade your systems today with Onsemi's top-of-the-line logic gates.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and resistance to environmental factors, making the product long-lasting.

Propagation Delay At Nominal Supply: 0.49 ns

Low propagation delay ensures fast processing speed and optimal performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

No. of Inputs: 4

Having 4 inputs allows for more complex logic operations to be performed.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, ensuring compatibility with most systems.

Power Supplies (V): -4.5

Supports negative power supplies for versatile usage in different circuit configurations.

No. of Terminals: 8

Having 8 terminals provides multiple connection options for flexibility in circuit design.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

Output Characteristics: OPEN-EMITTER

Open-emitter output allows for easy integration with other components in the circuit.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a variety of environments.

Technical Specifications

Logic Gates MC100LVEL01DG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3.0V TO -3.8V

Family:

100LVEL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

4

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

22 mA

Propagation Delay At Nominal Supply:

.49 ns

Propagation Delay (tpd):

.51 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100LVEL01DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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