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MC100EL07DG

Onsemi

MC100EL07DG by Onsemi

MC100EL07DG by Onsemi is a Logic Gate with 2 inputs, 0.395 ns propagation delay, and 5V nominal voltage. It is used in industrial applications for high-speed signal processing due to its ECL technology and small outline package style.

Median Price

$1.649

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,245 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.390

10k+ parts

$1.310

6,245

-

$1.560

$1.390

$1.310

Verical

USA . 6,245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.738

10k+ parts

$1.637

6,245

-

-

$1.738

$1.637

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,210 parts In-Stock

1+ parts

$1.644

100+ parts

-

1k+ parts

-

10k+ parts

-

2,210

$1.644

-

-

-

Vyrian

USA . 7,171 parts In-Stock

1+ parts

-

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-

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7,171

-

-

-

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Zilex Electronics Inc.

Canada . 33 parts In-Stock

1+ parts

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33

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Resion

USA . 18 parts In-Stock

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,331 parts In-Stock

1+ parts

$1.557

100+ parts

-

1k+ parts

-

10k+ parts

-

1,331

$1.557

-

-

-

Corohmni

South Africa . 282 parts In-Stock

1+ parts

$1.730

100+ parts

-

1k+ parts

-

10k+ parts

-

282

$1.730

-

-

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Component Stockers USA

USA . 5,447 parts In-Stock

1+ parts

$1.760

100+ parts

$1.660

1k+ parts

$1.500

10k+ parts

-

5,447

$1.760

$1.660

$1.500

-

AZTECH Wire

Italy . 810 parts In-Stock

1+ parts

$17.660

100+ parts

-

1k+ parts

-

10k+ parts

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810

$17.660

-

-

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SupplyDigital Components

Austria . 8,238 parts In-Stock

1+ parts

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8,238

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Continental Prestige Electronics

USA . 6,245 parts In-Stock

1+ parts

-

100+ parts

$1.510

1k+ parts

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6,245

-

$1.510

-

-

Problanco Electronics

Mexico . 5,759 parts In-Stock

1+ parts

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5,759

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Microchip USA

USA . 5,751 parts In-Stock

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5,751

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Kulean Microsystems

USA . 5,022 parts In-Stock

1+ parts

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5,022

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TANS Electronics

Latvia . 1,080 parts In-Stock

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1,080

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UHIMA Technologies

Türkiye . 168 parts In-Stock

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168

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Overview

Enhance your electronic projects with the MC100EL07DG from Onsemi, a leading manufacturer known for its high-quality logic gates. This versatile component offers fast propagation delay, low power consumption, and a wide operating temperature range, making it ideal for a variety of applications. Whether you're designing telecommunications equipment, data communications systems, or industrial controls, this small outline package with dual terminals will deliver reliable performance and efficiency. Trust Onsemi to provide innovative solutions that meet your needs and exceed your expectations. Upgrade your designs today with the MC100EL07DG!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good protection for the internal components of the logic gate.

Propagation Delay At Nominal Supply: 0.435 ns

Low propagation delay ensures fast operation of the logic gate, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly of the logic gate.

No. of Inputs: 2

Having 2 inputs allows for more complex logical operations to be performed by the gate.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes the logic gate compatible with common power supplies.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Technical Specifications

Logic Gates MC100EL07DG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC =0V WITH VEE = -4.2V TO -5.7V

Family:

100EL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay At Nominal Supply:

.435 ns

Propagation Delay (tpd):

.395 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC100EL07DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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