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M74VHC1GU04DFT2G

Onsemi

M74VHC1GU04DFT2G by Onsemi

M74VHC1GU04DFT2G by Onsemi is a CMOS Logic Gate with 9.5ns Propagation Delay, 3.3V Nominal Voltage, and 8A Max I (ol). Ideal for military applications due to its MILITARY Temperature Grade and small form factor in a PLASTIC/EPOXY package.

Median Price

$0.042

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 300 parts In-Stock

1+ parts

$0.071

100+ parts

$0.071

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$0.071

10k+ parts

$0.048

300

$0.071

$0.071

$0.071

$0.048

Rochester

USA . 331,811 parts In-Stock

1+ parts

-

100+ parts

$0.042

1k+ parts

$0.035

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$0.031

331,811

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$0.042

$0.035

$0.031

Verical

USA . 196,811 parts In-Stock

1+ parts

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$0.039

196,811

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$0.039

Chip1Stop

Japan . 300 parts In-Stock

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$0.043

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300

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$0.043

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Distributors (In-Stock)

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Digiode

USA . 1,234 parts In-Stock

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$0.033

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$0.033

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ACDS - Activité Composants Distribution Service

France . 6,000 parts In-Stock

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Bristol Electronics

USA . 6,000 parts In-Stock

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$0.150

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$0.045

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$0.030

6,000

-

$0.150

$0.045

$0.030

Dan-Mar Components

USA . 6,000 parts In-Stock

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Flip Electronics

USA . 5,285 parts In-Stock

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Vyrian

USA . 2,763 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,999 parts In-Stock

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$0.032

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$0.032

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Corohmni

South Africa . 346 parts In-Stock

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$0.035

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346

$0.035

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AZTECH Wire

Italy . 1,121 parts In-Stock

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$10.590

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$10.590

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$29.026

100+ parts

$26.414

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$23.801

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2,000

$29.026

$26.414

$23.801

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Perfect Parts

USA . 34,380 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,611 parts In-Stock

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Problanco Electronics

Mexico . 5,562 parts In-Stock

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TANS Electronics

Latvia . 4,622 parts In-Stock

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SupplyDigital Components

Austria . 4,528 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,407 parts In-Stock

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Microchip USA

USA . 369 parts In-Stock

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Kulean Microsystems

USA . 93 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 58 parts In-Stock

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UHIMA Technologies

Türkiye . 44 parts In-Stock

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Overview

Enhance your electronic projects with the M74VHC1GU04DFT2G by Onsemi, a high-quality logic gate that offers reliable performance and versatility. Manufactured by Onsemi, a trusted industry leader, this product is perfect for a wide range of applications in the tech world. With a compact design and low power consumption, this logic gate provides exceptional value and efficiency for all your circuit needs. Upgrade your projects today with the M74VHC1GU04DFT2G by Onsemi.

Feature Benefit Bullets

Package Body Material: Plastic/Epoxy

The use of plastic/epoxy as the package body material provides good insulation and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 9.5 ns

The low propagation delay at nominal supply voltage ensures fast processing and response times in the logic gates.

Surface Mount: Yes

Being surface mountable allows for easy installation and integration into circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage is commonly used in many electronic systems, making these logic gates versatile and compatible with a wide range of applications.

Power Supplies (V): 2/5.5

The range of power supply voltages from 2V to 5.5V provides flexibility in operating conditions and compatibility with different power sources.

No. of Terminals: 5

Having 5 terminals allows for simple connection and integration of the logic gates into circuits, reducing the complexity of wiring.

Package Style (Meter): Small Outline, Thin Profile, Shrink Pitch

The compact size and thin profile of the package make these logic gates suitable for applications where space is limited, while the shrink pitch design enhances reliability and performance.

Maximum I (ol): 8 Amp

The high maximum output current of 8A ensures robust performance and reliability in driving external loads or components.

Propagation Delay (tpd): 15.5 ns

The overall low propagation delay of 15.5ns ensures quick signal processing and response times in the logic gates, enhancing system performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows for reliable operation in a wide range of environmental conditions and applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures reliable performance even in cold or harsh operating conditions.

Terminal Finish: Matte Tin

The matte tin finish on the terminals provides good solderability and corrosion resistance, ensuring reliable connections in electronic assemblies.

Terminal Position: Dual

The dual terminal position allows for flexible mounting and connection options, suiting different circuit layouts and configurations.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1mm contributes to the compact and space-saving design of the logic gates, making them suitable for use in slim electronic devices.

Width: 1.25 mm

The narrow width of 1.25mm helps in fitting the logic gates into tight spaces or densely populated circuit boards, maximizing space efficiency.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage of 2V allows for operation in low-power or energy-efficient applications, enhancing versatility and compatibility.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and assembly of the logic gates during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C enables reliable and durable solder joints in the assembly of the logic gates, ensuring long-term performance.

Length: 2 mm

The compact length of 2mm contributes to the overall small form factor of the logic gates, making them suitable for space-constrained applications.

Temperature Grade: Military

The military-grade temperature rating ensures reliability and performance in harsh environmental conditions or demanding applications.

Technology: CMOS

The use of CMOS technology provides low power consumption, high noise immunity, and fast operation in the logic gates.

Terminal Form: Gull Wing

The gull wing terminal form allows for easy soldering and inspection processes during assembly, ensuring reliable and secure connections.

Packing Method: TR

The TR packing method ensures proper protection and handling of the logic gates during shipping and storage, reducing the risk of damage or contamination.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high packing density and precise placement of the logic gates on circuit boards, optimizing board space usage.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources and operating conditions, enhancing flexibility in system design.

Technical Specifications

Logic Gates M74VHC1GU04DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

15.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

M74VHC1GU04DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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