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M74VHC1GT14DFT1G

Onsemi

M74VHC1GT14DFT1G by Onsemi

M74VHC1GT14DFT1G by Onsemi is a CMOS Logic Gate with Schmitt Trigger. It operates at 3V, has 5 terminals, and a propagation delay of 20.5ns. Ideal for military applications due to its MILITARY temperature grade and small outline package style.

Median Price

$0.213

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$0.277

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Chip Stock

USA . 34,162 parts In-Stock

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Cyclops Electronics Ltd

UK . 8,022 parts In-Stock

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Vyrian

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ComSIT Distribution GmbH

Germany . 1,534 parts In-Stock

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ComSIT USA

USA . 1,534 parts In-Stock

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Digiode

USA . 409 parts In-Stock

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Bristol Electronics

USA . 325 parts In-Stock

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$0.150

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$0.075

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325

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Distributors (Availability)

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Semicontronic

India . 2,907 parts In-Stock

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$0.090

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$0.088

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$0.087

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2,907

$0.090

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Corohmni

South Africa . 342 parts In-Stock

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$0.106

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342

$0.106

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Ampacity Inc.

Singapore . 2,666 parts In-Stock

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$0.196

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Argo Parts USA

USA . 2,206 parts In-Stock

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$0.277

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$0.268

2,206

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Netroflash

USA . 1,000 parts In-Stock

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$0.277

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$0.271

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Continental Prestige Electronics

USA . 3 parts In-Stock

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$0.277

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$0.271

3

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Microchip USA

USA . 240 parts In-Stock

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$0.839

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$0.839

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AZTECH Wire

Italy . 387 parts In-Stock

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$15.180

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Aztec Data Supply Inc.

USA . 1,406 parts In-Stock

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$20.020

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Advanced Electronics

New Zealand . 88 parts In-Stock

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$31.697

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Kepictronics

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Perfect Parts

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RC Electronics

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Authorized Procurement Solutions

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Kulean Microsystems

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A-Z Elektronik GmbH

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Lixinc

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SupplyDigital Components

Austria . 2,294 parts In-Stock

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Corphita

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Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Problanco Electronics

Mexico . 664 parts In-Stock

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UHIMA Technologies

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TANS Electronics

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Overview

Elevate your electronic projects with the M74VHC1GT14DFT1G by Onsemi, a top-quality logic gate that brings reliability and efficiency to your designs. Manufactured by the reputable company Onsemi, this product is ideal for a wide range of applications where precision and performance are essential. With a compact design and advanced technology, this logic gate delivers unparalleled value and benefits to customers, ensuring seamless operation and optimal functionality. Upgrade your projects today with the M74VHC1GT14DFT1G and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Propagation Delay (tpd): 20.5 ns

Provides fast signal processing speeds, making the logic gates suitable for high-speed applications.

Temperature Grade: MILITARY

Indicates that the logic gates are built to withstand harsh environmental conditions, suitable for military and aerospace applications.

Schmitt Trigger: YES

Helps to eliminate noise and provide hysteresis, ensuring stable and reliable operation of the logic gates.

Technical Specifications

Logic Gates M74VHC1GT14DFT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

20.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

M74VHC1GT14DFT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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