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M74VHC1GT50DTT1G

Onsemi

M74VHC1GT50DTT1G by Onsemi

M74VHC1GT50DTT1G by Onsemi is a CMOS logic gate with 10 ns propagation delay at 1.8V, suitable for military-grade applications. It features a max operating temperature of 125°C, surface mount packaging, and a load capacitance of 50 pF. With a small outline and thin profile package style, it has dual terminals and operates within a supply voltage range of 1.65V to 5.5V.

Median Price

$0.247

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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DigiKey

USA . 3 parts In-Stock

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$0.410

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Rochester

USA . 3,000 parts In-Stock

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$0.084

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$0.070

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$0.063

3,000

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$0.084

$0.070

$0.063

Distributors (In-Stock)

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Digiode

USA . 178 parts In-Stock

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$0.390

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$0.390

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Nova Conductors

Japan . 67 parts In-Stock

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Chip Stock

USA . 525,500 parts In-Stock

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Flip Electronics

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Sensible Micro Corp

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Bristol Electronics

USA . 9,148 parts In-Stock

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Vyrian

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ComSIT Distribution GmbH

Germany . 2,250 parts In-Stock

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Avant Electronics Limited

UK . 993 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 350 parts In-Stock

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Contempo Components LLC

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Sunrise Surplus Inc.

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Speed Components Ltd

Israel . 100 parts In-Stock

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Semtec, LLC

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Rebound Electronics

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Distributors (Availability)

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Continental Prestige Electronics

USA . 1,586 parts In-Stock

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$0.122

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$0.120

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Argo Parts USA

USA . 1,350 parts In-Stock

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$0.122

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$0.118

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$0.122

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$0.118

Modulus Dynamics

Lithuania . 59 parts In-Stock

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$0.135

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$0.134

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$0.130

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$0.135

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Semicontronic

India . 3 parts In-Stock

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$0.348

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$0.339

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$0.338

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$0.348

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Corphita

USA . 1,509 parts In-Stock

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$0.369

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Corohmni

South Africa . 367 parts In-Stock

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$0.410

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Ampacity Inc.

Singapore . 7,459 parts In-Stock

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$0.760

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AZTECH Wire

Italy . 645 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,406 parts In-Stock

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Perfect Parts

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Epart123

USA . 120,000 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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SupplyDigital Components

Austria . 7,781 parts In-Stock

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TANS Electronics

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Brazil . 3,071 parts In-Stock

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Lucentia Tech

USA . 3,071 parts In-Stock

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iodParts Technologies Inc.

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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Problanco Electronics

Mexico . 2,595 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

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Kulean Microsystems

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Lixinc

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UHIMA Technologies

Türkiye . 258 parts In-Stock

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Overview

Enhance your circuit designs with the M74VHC1GT50DTT1G by Onsemi, a high-quality Logic Gate offering unmatched performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is perfect for a wide range of applications. From consumer electronics to industrial automation, this Logic Gate delivers exceptional value, benefits, and advantages to customers looking for top-notch components. Upgrade your projects with the M74VHC1GT50DTT1G and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 10 ns

Fast propagation delay allows for quick signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Allows for easy and efficient mounting on a PCB, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement helps in reducing power consumption and is compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for various industrial and harsh environments.

Technical Specifications

Logic Gates M74VHC1GT50DTT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

25.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.5 mm

Trade Compliance

M74VHC1GT50DTT1G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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