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M74VHC1G132DFT2G-L22038

Onsemi

M74VHC1G132DFT2G-L22038 by Onsemi

M74VHC1G132DFT2G-L22038 by Onsemi is a CMOS Logic Gate with 2 inputs, 19.6 ns propagation delay, and 3-STATE output. It operates at a voltage range of 2-5.5 V and can handle up to 50 pF load capacitance. Ideal for applications requiring fast signal processing in compact electronic devices.

Median Price

$0.069

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 3,000 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.069

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10

$0.069

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Flip Electronics

USA . 72,000 parts In-Stock

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72,000

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Vyrian

USA . 6,782 parts In-Stock

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Digiode

USA . 132 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 390 parts In-Stock

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$0.068

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390

$0.068

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Continental Prestige Electronics

USA . 3,734 parts In-Stock

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$0.069

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$0.068

3,734

$0.069

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$0.068

Argo Parts USA

USA . 3,634 parts In-Stock

1+ parts

$0.069

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$0.067

3,634

$0.069

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$0.067

AZTECH Wire

Italy . 1,072 parts In-Stock

1+ parts

$10.670

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1,072

$10.670

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Aztec Data Supply Inc.

USA . 1,901 parts In-Stock

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$14.880

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$14.880

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Microchip USA

USA . 143 parts In-Stock

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$16.380

100+ parts

$16.330

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$16.330

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$16.280

143

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$16.330

$16.330

$16.280

Ampacity Inc.

Singapore . 2,949 parts In-Stock

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$31.000

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Semicontronic

India . 2,752 parts In-Stock

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$59.000

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$57.525

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$57.230

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Problanco Electronics

Mexico . 6,077 parts In-Stock

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Kulean Microsystems

USA . 3,495 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 2,121 parts In-Stock

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Corphita

USA . 1,454 parts In-Stock

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TANS Electronics

Latvia . 1,050 parts In-Stock

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UHIMA Technologies

Türkiye . 988 parts In-Stock

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Robosynatics

Brazil . 591 parts In-Stock

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Lucentia Tech

USA . 591 parts In-Stock

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$2.215

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$2.215

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$2.215

591

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$2.215

Overview

Enhance your electronic projects with the M74VHC1G132DFT2G-L22038 by Onsemi. Crafted with precision and expertise, this Logic Gate offers reliable performance and efficient operation. Perfect for a range of applications, this product provides a seamless solution for your circuit design needs. With its compact design and advanced features, this Logic Gate delivers exceptional value and quality, making it an essential component for your next project. Elevate your creations with the Onsemi M74VHC1G132DFT2G-L22038.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 19.6 ns

Low propagation delay ensures fast operation and quick response times, making this logic gate suitable for applications requiring speedy processing.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on printed circuit boards, saving space and simplifying assembly.

No. of Inputs: 2

Having 2 inputs provides flexibility in designing logic circuits, allowing for various input configurations and logical operations.

Nominal Supply Voltage: 3 V

Operating at a standard 3V supply voltage makes this logic gate compatible with many common electronic systems and power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliable performance in a wide range of environmental conditions, making this logic gate suitable for industrial applications.

Technical Specifications

Logic Gates M74VHC1G132DFT2G-L22038 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-XDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

19.6 ns

Propagation Delay (tpd):

19.6 ns

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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