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M74VHC1GT08DFT2G

Onsemi

M74VHC1GT08DFT2G by Onsemi

M74VHC1GT08DFT2G by Onsemi is a logic gate with 2 inputs, 11 ns propagation delay at 3.3V, and 16.5 ns propagation delay. It operates in a temperature range of -55 to 125 °C and has a max supply voltage of 5.5 V. Ideal for applications requiring high-speed signal processing in compact electronic devices.

Median Price

$0.253

Lifecycle Status

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16

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1k+

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Arrow

USA . 1 parts In-Stock

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$0.054

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-

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1

$0.054

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EBV Elektronik

Germany . 441,000 parts In-Stock

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441,000

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DigiKey

USA . 279,000 parts In-Stock

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279,000

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Flip Electronics (Authorized)

USA . 183,000 parts In-Stock

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183,000

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RS (Exports)

UK . 7,300 parts In-Stock

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$0.253

7,300

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$0.253

Verical

USA . 6,000 parts In-Stock

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$0.347

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6,000

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$0.347

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Digiode

USA . 131 parts In-Stock

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$0.029

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131

$0.029

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Nova Conductors

Japan . 59 parts In-Stock

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$0.289

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59

$0.289

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DigiKey Marketplace

USA . 261,000 parts In-Stock

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Flip Electronics

USA . 168,000 parts In-Stock

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Chip Stock

USA . 97,490 parts In-Stock

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97,490

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Vyrian

USA . 94,822 parts In-Stock

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Cyclops Electronics Ltd

UK . 46,504 parts In-Stock

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NAC Semi

USA . 30,000 parts In-Stock

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$0.048

30,000

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$0.048

Bristol Electronics

USA . 2,415 parts In-Stock

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2,415

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TME

Poland . 5 parts In-Stock

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$0.053

1k+ parts

$0.048

10k+ parts

$0.042

5

-

$0.053

$0.048

$0.042

Distributors (Availability)

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Semicontronic

India . 152,411 parts In-Stock

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$0.026

100+ parts

$0.025

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$0.025

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152,411

$0.026

$0.025

$0.025

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Corphita

USA . 2,475 parts In-Stock

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$0.028

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2,475

$0.028

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Corohmni

South Africa . 394 parts In-Stock

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$0.031

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394

$0.031

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Ampacity Inc.

Singapore . 94,623 parts In-Stock

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$0.057

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94,623

$0.057

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Continental Prestige Electronics

USA . 6,257 parts In-Stock

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$0.289

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$0.283

6,257

$0.289

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$0.283

Argo Parts USA

USA . 1,769 parts In-Stock

1+ parts

$0.289

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$0.280

1,769

$0.289

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$0.280

Aztec Data Supply Inc.

USA . 220 parts In-Stock

1+ parts

$8.930

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220

$8.930

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RC Electronics

USA . 131,917 parts In-Stock

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Kepictronics

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Lixinc

USA . 18,307 parts In-Stock

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TANS Electronics

Latvia . 8,339 parts In-Stock

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SupplyDigital Components

Austria . 6,601 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,615 parts In-Stock

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Problanco Electronics

Mexico . 5,248 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,743 parts In-Stock

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Robosynatics

Brazil . 3,066 parts In-Stock

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Lucentia Tech

USA . 3,066 parts In-Stock

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$19.417

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$19.020

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$19.020

3,066

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$19.020

$19.020

Kulean Microsystems

USA . 2,211 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 359 parts In-Stock

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Microchip USA

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ChipstoGo Electronic ltd

UK . 24 parts In-Stock

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Overview

Enhance your electronic projects with the M74VHC1GT08DFT2G by Onsemi, a top-quality logic gate that offers fast propagation delay and high output characteristics. Manufactured by Onsemi, a trusted leader in semiconductor technology, this versatile component is ideal for a wide range of applications. With a compact design and reliable performance, this logic gate provides exceptional value for customers seeking efficient solutions for their projects. Upgrade your designs with the M74VHC1GT08DFT2G and experience the benefits of superior quality and performance.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the internal components, ensuring a longer lifespan.

Propagation Delay At Nominal Supply:

11 ns - Offers fast signal processing, ideal for high-speed applications.

Surface Mount:

YES - Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

No. of Inputs:

2 - Versatile design accommodating multiple input signals for complex logic operations.

Nominal Supply Voltage / Vsup (V):

3.3 - Suitable for a wide range of applications requiring a stable power source.

Load Capacitance (CL):

50 pF - Ensures compatibility with various external components, enhancing usability.

Power Supplies (V):

3.3/5 - Flexibility in power options, accommodating different system requirements.

No. of Terminals:

5 - Compact and space-saving layout, ideal for applications with limited board space.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Provides a compact form factor for densely populated PCBs.

Maximum I (ol):

8 Amp - High output current capability for driving multiple loads without external amplification.

Propagation Delay (tpd):

16.5 ns - Reliable signal propagation time, ensuring accurate timing in critical operations.

Maximum Operating Temperature:

125 °C - Suitable for use in harsh environments with elevated temperatures.

Output Characteristics:

3-STATE - Offers additional control over the output signal, improving versatility in circuit design.

Minimum Operating Temperature:

55 °C - Reliable performance in extreme cold conditions, expanding the range of possible applications.

Terminal Finish:

Matte Tin (Sn) - annealed - Provides a corrosion-resistant and durable finish for long-term reliability.

Terminal Position:

DUAL - Facilitates easy and secure connection to the PCB, enhancing overall robustness.

Maximum Seated Height:

1.1 mm - Low-profile design for applications with height restrictions, optimizing space utilization.

Width:

1.25 mm - Compact dimensions for efficient layout and placement on the PCB.

Minimum Supply Voltage (Vsup):

3 V - Allows for operation in low-power scenarios, conserving energy and extending battery life.

Maximum Time At Peak Reflow Temperature (s):

40 - Facilitates convenient and efficient soldering during assembly processes.

Peak Reflow Temperature °C:

260 - Withstands high-temperature soldering processes, ensuring robust connections.

Length:

2 mm - Compact size for easy integration into space-constrained designs.

Temperature Grade:

MILITARY - Meets stringent reliability and performance standards for critical military applications.

Technology:

CMOS - Offers low power consumption and high noise immunity, suitable for battery-operated devices.

Terminal Form:

GULL WING - Secure and reliable connection to the PCB for enhanced durability in harsh conditions.

Packing Method:

TR - Convenient packaging for easy handling and storage during production and transportation.

Terminal Pitch:

0.65 mm - Fine pitch for precise connections, ensuring reliable signal transmission in high-density layouts.

Maximum Supply Voltage (Vsup):

5.5 V - Provides a wide operating voltage range, accommodating various power sources.

Maximum Power Supply Current (ICC):

50 mA - Low power consumption for energy-efficient operation, suitable for battery-powered devices.

Technical Specifications

Logic Gates M74VHC1GT08DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.25 mm

Trade Compliance

M74VHC1GT08DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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