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M74VHC1GT32DFT1G

Onsemi

M74VHC1GT32DFT1G by Onsemi

M74VHC1GT32DFT1G by Onsemi is a logic gate with 2 inputs, 10 ns propagation delay at 3.3V supply, and 50 pF load capacitance. It is used in applications requiring fast signal processing and operates within a temperature range of -55 to 125 °C. This small outline package with dual terminals is suitable for military-grade electronics.

Median Price

$0.042

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Arrow

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Verical

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Chip1Stop

Japan . 78,810 parts In-Stock

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Greenchips

USA . 4,945 parts In-Stock

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$0.028

Nova Conductors

Japan . 96 parts In-Stock

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Digiode

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Flip Electronics

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Vyrian

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Quantum Digital Technology

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Connector Distribution Corp

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Sea View Technologies

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Bristol Electronics

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Prism Electronics

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Continental Prestige Electronics

USA . 4,309 parts In-Stock

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Argo Parts USA

USA . 2,451 parts In-Stock

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Advanced Electronics

New Zealand . 350 parts In-Stock

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Ampacity Inc.

Singapore . 84,192 parts In-Stock

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Corohmni

South Africa . 326 parts In-Stock

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Aztec Data Supply Inc.

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Overview

Discover the M74VHC1GT32DFT1G by Onsemi, a high-quality logic gate that offers fast propagation delay and low power consumption. Manufactured by Onsemi, known for their cutting-edge technology and reliability, this logic gate is perfect for various applications. With a small outline package and dual terminal position, this product provides convenience and versatility. Experience seamless integration with a nominal supply voltage of 3.3V and a maximum operating temperature of 125°C. Trust in Onsemi to deliver exceptional value and performance with the M74VHC1GT32DFT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 10 ns

The low propagation delay of 10 ns at nominal supply voltage ensures fast and efficient operation of the logic gates, making them suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into PCB designs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V is commonly used in many electronic systems, making this product compatible with a wide range of applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the logic gates can withstand harsh environmental conditions, ensuring reliability in various settings.

Technical Specifications

Logic Gates M74VHC1GT32DFT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

15.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

M74VHC1GT32DFT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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