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LV8731V-TLM-H

Onsemi

LV8731V-TLM-H by Onsemi

LV8731V-TLM-H by Onsemi is a Motion Control IC with 24V supply voltage, 2.5A output current, and BCDMOS technology. Ideal for stepper motor control applications due to its small outline package, dual terminal position, and low profile design. Operating temperature range from -20 °C to 85°C makes it versatile for various industrial uses.

Median Price

$1.850

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,229 parts In-Stock

1+ parts

-

100+ parts

$1.750

1k+ parts

$1.560

10k+ parts

$1.470

1,229

-

$1.750

$1.560

$1.470

Verical

USA . 1,166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.950

10k+ parts

$1.837

1,166

-

-

$1.950

$1.837

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 469 parts In-Stock

1+ parts

$1.852

100+ parts

-

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-

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469

$1.852

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Maritex

Poland . 540 parts In-Stock

1+ parts

$4.306

100+ parts

$2.597

1k+ parts

$2.194

10k+ parts

-

540

$4.306

$2.597

$2.194

-

Flip Electronics

USA . 62,000 parts In-Stock

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62,000

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Vyrian

USA . 6,507 parts In-Stock

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6,507

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Semtec, LLC

USA . 273 parts In-Stock

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273

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Distributors (Availability)

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Corphita

USA . 974 parts In-Stock

1+ parts

$1.755

100+ parts

-

1k+ parts

-

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974

$1.755

-

-

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Corohmni

South Africa . 234 parts In-Stock

1+ parts

$1.950

100+ parts

-

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234

$1.950

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AZTECH Wire

Italy . 176 parts In-Stock

1+ parts

$16.630

100+ parts

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176

$16.630

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GreenTree Electronics

Israel . 223,000 parts In-Stock

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Perfect Parts

USA . 80,468 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,366 parts In-Stock

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23,366

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Kulean Microsystems

USA . 7,169 parts In-Stock

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7,169

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Problanco Electronics

Mexico . 6,524 parts In-Stock

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6,524

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TANS Electronics

Latvia . 5,478 parts In-Stock

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5,478

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RC Electronics

USA . 5,294 parts In-Stock

1+ parts

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100+ parts

$3.330

1k+ parts

$3.040

10k+ parts

$2.950

5,294

-

$3.330

$3.040

$2.950

SupplyDigital Components

Austria . 4,837 parts In-Stock

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4,837

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A-Z Elektronik GmbH

Germany . 4,689 parts In-Stock

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4,689

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Alle Elektronik GmbH

Germany . 3,126 parts In-Stock

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3,126

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Authorized Procurement Solutions

USA . 2,936 parts In-Stock

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2,936

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Microchip USA

USA . 384 parts In-Stock

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384

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UHIMA Technologies

Türkiye . 132 parts In-Stock

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132

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iodParts Technologies Inc.

India . 110 parts In-Stock

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$2.396

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110

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$2.396

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Kepictronics

USA . 60 parts In-Stock

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60

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Overview

Unlock the power of precise motion control with the LV8731V-TLM-H by Onsemi. Crafted with precision and quality, this motion control IC is designed to elevate your applications to new heights. Whether you're in robotics, automation, or 3D printing, this product offers unmatched value, efficiency, and reliability. Say goodbye to limitations and hello to endless possibilities with the LV8731V-TLM-H. Elevate your projects with Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring long-term reliability of the product.

Surface Mount: YES

Ease of installation and maintenance, suitable for automated assembly processes.

Nominal Supply Voltage (Vsup): 24 V

Optimal operating voltage for efficient performance and compatibility with standard power supplies.

Maximum Operating Temperature: 85 °C

Ability to operate in higher temperature environments, increasing the versatility of the product.

Minimum Operating Temperature: -20 °C

Suitable for use in extreme cold temperatures, making it a reliable choice for various applications.

Maximum Output Current: 2.5 A

Capable of delivering high current output for driving stepper motors effectively.

Technology: BCDMOS

Utilizes BCDMOS technology for efficient power management and control, enhancing performance and reliability.

Technical Specifications

Motion Control ICs LV8731V-TLM-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e6

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

2.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP44,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

32 V

Minimum Supply Voltage (Vsup):

9 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.6 mm

Trade Compliance

LV8731V-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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