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LV8731V-MPB-H

Onsemi

LV8731V-MPB-H by Onsemi

LV8731V-MPB-H by Onsemi is a Motion Control IC with 24V supply, 2.5A output current, and BCDMOS technology. Ideal for stepper motor control applications due to its small outline package, low profile design, and dual terminal position. Operating temperature ranges from -20 °C to 85°C making it suitable for various industrial environments.

Median Price

$1.550

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8 parts In-Stock

1+ parts

-

100+ parts

$1.550

1k+ parts

$1.290

10k+ parts

$1.150

8

-

$1.550

$1.290

$1.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,167 parts In-Stock

1+ parts

$1.206

100+ parts

-

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1,167

$1.206

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Vyrian

USA . 4,731 parts In-Stock

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4,731

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Distributors (Availability)

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Corphita

USA . 646 parts In-Stock

1+ parts

$1.143

100+ parts

-

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646

$1.143

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Corohmni

South Africa . 249 parts In-Stock

1+ parts

$1.270

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249

$1.270

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AZTECH Wire

Italy . 658 parts In-Stock

1+ parts

$8.990

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658

$8.990

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QUARKTWIN TECHNOLOGY LTD

USA . 27,142 parts In-Stock

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27,142

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SupplyDigital Components

Austria . 7,004 parts In-Stock

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7,004

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Kulean Microsystems

USA . 6,936 parts In-Stock

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6,936

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Microchip USA

USA . 6,298 parts In-Stock

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6,298

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Problanco Electronics

Mexico . 4,867 parts In-Stock

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4,867

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TANS Electronics

Latvia . 3,860 parts In-Stock

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3,860

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UHIMA Technologies

Türkiye . 235 parts In-Stock

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235

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Perfect Parts

USA . 52 parts In-Stock

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Overview

Enhance your motion control applications with the LV8731V-MPB-H by Onsemi. This high-quality motion control IC offers unparalleled performance and reliability, thanks to Onsemi's reputation for excellence in manufacturing. Perfect for stepper motor controllers, this product delivers exceptional value, providing customers with precise control and efficient operation. Upgrade your projects with the LV8731V-MPB-H and experience the benefits of superior technology and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the motion control IC, ensuring long-term reliability.

Nominal Supply Voltage (Vsup): 24 V

Compatible with standard industrial power supplies, making it easy to integrate into existing systems.

No. of Terminals: 44

Offers a wide range of connection options for various components, allowing for versatile integration.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of operating environments, including industrial settings.

Technology: BCDMOS

Utilizes advanced BCDMOS technology for efficient power management and control, enhancing overall performance.

Technical Specifications

Motion Control ICs LV8731V-MPB-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e6

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

2.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP44,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

32 V

Minimum Supply Voltage (Vsup):

9 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.6 mm

Trade Compliance

LV8731V-MPB-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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