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LV8711T-MPB-H

Onsemi

LV8711T-MPB-H by Onsemi

LV8711T-MPB-H by Onsemi is a Motion Control IC with 24 terminals, operating at -20 to 85 °C. It supports power supplies of 3.3V and 12V, featuring BICMOS technology and GULL WING terminals. Ideal for applications requiring precise motion control in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 9,948 parts In-Stock

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Digiode

USA . 1,911 parts In-Stock

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AZTECH Wire

Italy . 704 parts In-Stock

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$9.490

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Kulean Microsystems

USA . 6,148 parts In-Stock

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TANS Electronics

Latvia . 3,461 parts In-Stock

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Corphita

USA . 1,839 parts In-Stock

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Problanco Electronics

Mexico . 1,094 parts In-Stock

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UHIMA Technologies

Türkiye . 715 parts In-Stock

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715

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SupplyDigital Components

Austria . 198 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 127 parts In-Stock

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Perfect Parts

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Overview

Enhance your motion control systems with the LV8711T-MPB-H by Onsemi, a top-quality product designed to deliver precise and efficient operation. Onsemi's reputation for excellence ensures reliability and durability in every application of this category. Whether you're looking to improve robotics, automation, or other motion control applications, this IC offers unmatched value, benefits, and advantages that will elevate your projects to new heights. Trust in Onsemi to provide cutting-edge solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, making it ideal for applications where weight and durability are important factors.

Surface Mount: YES

The surface mount feature allows for easy and flexible installation on PCBs, saving space and simplifying the assembly process.

Power Supplies (V): 3.3, 12

Supporting multiple power supply voltages (3.3V and 12V) provides compatibility with a wide range of systems and applications, increasing the versatility of the product.

No. of Terminals: 24

Having 24 terminals allows for more connection options, enabling the device to interface with a variety of components and peripherals.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can withstand high temperature environments, ensuring reliability in challenging conditions.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish provides good solderability and corrosion resistance, contributing to the longevity and reliability of the product.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of bipolar and CMOS technologies, offering high-speed performance and low power consumption, making it an efficient choice for motion control applications.

Technical Specifications

Motion Control ICs LV8711T-MPB-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,12

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

3 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LV8711T-MPB-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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