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LC87F7932BUWC-3H

Onsemi

LC87F7932BUWC-3H by Onsemi

LC87F7932BUWC-3H by Onsemi is an 8-bit microcontroller with a max clock frequency of 0.032768 MHz. It features 7-Ch 12-Bit ADC channels, UART connectivity, and low power mode. Ideal for industrial applications requiring a compact design with 64 terminals and on-chip data RAM width of 8 bits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,740 parts In-Stock

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Digiode

USA . 2,396 parts In-Stock

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AZTECH Wire

Italy . 63 parts In-Stock

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$9.030

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Component Stockers USA

USA . 232 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 6,871 parts In-Stock

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Microchip USA

USA . 5,233 parts In-Stock

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Kulean Microsystems

USA . 4,108 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,887 parts In-Stock

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TANS Electronics

Latvia . 1,226 parts In-Stock

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UHIMA Technologies

Türkiye . 761 parts In-Stock

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Corphita

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Corohmni

South Africa . 430 parts In-Stock

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SupplyDigital Components

Austria . 217 parts In-Stock

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Overview

Discover the cutting-edge LC87F7932BUWC-3H microcontroller by Onsemi, a top-tier manufacturer known for high-quality products. Perfect for a wide range of applications, this microcontroller offers unparalleled value with its advanced features and reliable performance. From industrial automation to consumer electronics, this versatile device provides customers with a competitive edge, delivering efficient power management and seamless connectivity. Upgrade your projects with the LC87F7932BUWC-3H and experience a new level of innovation and reliability in your designs.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the microcontroller from external elements, ensuring a longer lifespan.

Maximum Supply Voltage : 3.6 V

Ability to support higher voltage levels allows for versatile use in different applications requiring higher power.

RAM Words : 2048

Ample RAM capacity enables efficient storage and processing of data, making it suitable for complex tasks.

Peripheral IC Type : MICROCONTROLLER

Dedicated peripheral integration as a microcontroller ensures seamless operation with various hardware components for enhanced functionality.

Analog To Digital Convertors : 7-Ch 12-Bit

Multiple ADC channels with higher resolution ensure accurate conversion of analog signals to digital data for precise sensing and control tasks.

Connectivity : UART

UART connectivity allows for easy and reliable data transfer between devices, enhancing communication capabilities.

ROM Programmability : FLASH

Flash ROM programmability offers flexibility in updating and reprogramming the software, facilitating easy maintenance and upgrades.

Speed : 8 rpm

Operates at a moderate speed of 8 rpm, suitable for a wide range of applications without excessive power consumption or heat generation.

Technical Specifications

Microcontrollers LC87F7932BUWC-3H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e6

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

21

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

5.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

UART

Peripherals:

LCD, POR, TIMER(6), RTC, WDT

Analog To Digital Convertors:

7-Ch 12-Bit

Trade Compliance

LC87F7932BUWC-3H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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