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LC87F1JJ8AUWA-2H

Onsemi

LC87F1JJ8AUWA-2H by Onsemi

LC87F1JJ8AUWA-2H by Onsemi is an 8-bit microcontroller with 196608 ROM words, 35 I/O lines, and a max clock frequency of 12 MHz. It is used in applications requiring low-profile, fine-pitch packages such as PWM control systems for motors operating at speeds up to 12 rpm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,683 parts In-Stock

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8,683

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Digiode

USA . 760 parts In-Stock

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760

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Distributors (Availability)

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AZTECH Wire

Italy . 187 parts In-Stock

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$10.790

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187

$10.790

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$49.923

100+ parts

$45.430

1k+ parts

$40.937

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3,000

$49.923

$45.430

$40.937

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SupplyDigital Components

Austria . 7,052 parts In-Stock

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7,052

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Kulean Microsystems

USA . 6,557 parts In-Stock

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6,557

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Problanco Electronics

Mexico . 4,724 parts In-Stock

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4,724

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Corphita

USA . 1,492 parts In-Stock

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TANS Electronics

Latvia . 788 parts In-Stock

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788

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Microchip USA

USA . 408 parts In-Stock

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408

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UHIMA Technologies

Türkiye . 230 parts In-Stock

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Corohmni

South Africa . 172 parts In-Stock

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Overview

Unleash the power of innovation with the LC87F1JJ8AUWA-2H microcontroller by Onsemi. Designed for excellence, this cutting-edge device offers unparalleled quality and reliability. Perfect for a wide range of applications, this microcontroller provides seamless integration and high-performance capabilities. Experience the value and benefits of this product as it enhances efficiency and functionality in your projects. Upgrade to Onsemi and elevate your technology game today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options, making this microcontroller suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape makes PCB layout and design simpler and more efficient, optimizing space usage.

Bit Size: 8

An 8-bit microcontroller offers a good balance between performance and cost, making it suitable for many general-purpose applications.

No. of Terminals: 48

Having 48 terminals provides ample I/O options for connecting external devices and peripherals, making this microcontroller versatile.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style saves space on the PCB and allows for higher component density, ideal for compact designs.

Minimum Supply Voltage: 3 V

The low minimum supply voltage allows for operation in battery-powered applications and enhances energy efficiency.

ADC Channels: YES

Having ADC channels enables analog-to-digital conversion, making this microcontroller suitable for applications that require sensor interfacing or analog input processing.

Terminal Position: QUAD

The quad terminal position simplifies PCB routing and connection, reducing signal interference and improving reliability.

ROM Words: 196608

With a large ROM size of 196608 words, this microcontroller can store a substantial amount of program code and data, suitable for complex applications.

Width: 7 mm

The compact width of 7 mm makes this microcontroller suitable for space-constrained designs, such as portable electronics or IoT devices.

Maximum Clock Frequency: 12 MHz

A maximum clock frequency of 12 MHz provides sufficient processing power for many real-time applications while keeping power consumption low.

Length: 7 mm

The short length of 7 mm further contributes to the compact form factor and space-saving design of this microcontroller.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various built-in peripherals, this product offers a complete solution for embedded system development without the need for additional external components.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, making this microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form offers robust mechanical strength and ease of soldering during assembly, ensuring reliable connections for long-term operation.

PWM Channels: YES

Having PWM channels allows for precise control of analog outputs, such as motor speed or LED brightness, enhancing the versatility and performance of this microcontroller.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density interconnection, making this microcontroller suitable for compact designs and miniaturized electronics.

Speed: 12 rpm

With a speed of 12 rpm, this microcontroller is capable of handling real-time tasks and applications that require fast computation and response times.

No. of I/O Lines: 35

Having 35 I/O lines provides ample interfacing options for connecting external devices and sensors, making this microcontroller versatile and suitable for a wide range of applications.

Technical Specifications

Microcontrollers LC87F1JJ8AUWA-2H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

35

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

196608

Speed:

12 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LC87F1JJ8AUWA-2H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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