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LC786821E

Onsemi

LC786821E by Onsemi

LC786821E by Onsemi is a consumer IC with 100 terminals in a rectangular flatpack package. It operates b/w -40 °C to 85°C, with supply voltage ranging from 3V to 3.6V. This industrial-grade IC is ideal for various consumer circuit applications requiring surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 458 parts In-Stock

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458

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Digiode

USA . 171 parts In-Stock

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171

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 6,218 parts In-Stock

1+ parts

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6,218

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Problanco Electronics

Mexico . 4,683 parts In-Stock

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4,683

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TANS Electronics

Latvia . 2,773 parts In-Stock

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2,773

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SupplyDigital Components

Austria . 2,234 parts In-Stock

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2,234

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Corphita

USA . 1,865 parts In-Stock

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1,865

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UHIMA Technologies

Türkiye . 726 parts In-Stock

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726

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Corohmni

South Africa . 401 parts In-Stock

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401

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Overview

Unleash the power of innovation with the LC786821E by Onsemi, a cutting-edge consumer IC that guarantees top-notch quality and reliability. Designed by industry leaders, this product offers unmatched value and benefits for a wide range of applications. From enhancing performance to increasing efficiency, the LC786821E delivers superior results that will exceed your expectations. Experience the advantage of choosing a trusted manufacturer like Onsemi and take your projects to the next level with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, making this product suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easy integration into PCB designs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of board space and easy placement in a circuit layout.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC provides reliable performance for a range of consumer electronics.

No. of Terminals: 100

With a high number of terminals, this IC offers a wide range of connectivity options for various external components.

Package Style (Meter): FLATPACK

The flatpack style of the package provides a low profile design, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance even in elevated temperature environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance.

Terminal Position: QUAD

The quad terminal position provides easy soldering and ensures secure connections for reliable operation.

Maximum Seated Height: 3 mm

The low seated height of the package allows for compact designs and enables versatility in product applications.

Width: 14 mm

The small width of the package contributes to space-saving design considerations and flexibility in PCB layouts.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement allows for operation in low-power applications, optimizing energy efficiency.

Length: 20 mm

The moderate length of the package provides a balance between compact size and functionality in various electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC can withstand harsh environmental conditions and deliver reliable performance in demanding settings.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and enhances the overall mechanical strength of the connections.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density mounting and allows for intricate PCB designs with tight component spacing.

Maximum Supply Voltage (Vsup): 3.6 V

The moderate maximum supply voltage capability ensures compatibility with a wide range of power sources, enhancing versatility in system integration.

Technical Specifications

Other Function Consumer ICs LC786821E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

3 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

LC786821E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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