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LC78637E

Onsemi

LC78637E by Onsemi

LC78637E by Onsemi is a consumer IC with 80 terminals, operating at temperatures from -20 °C to 70°C. It features a power supply of 3.3V and utilizes CMOS technology. This surface-mount IC in a square package is ideal for various consumer circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,351 parts In-Stock

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Vyrian

USA . 1,088 parts In-Stock

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1,088

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TANS Electronics

Latvia . 8,299 parts In-Stock

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Problanco Electronics

Mexico . 8,229 parts In-Stock

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Assy Fe

Spain . 6,796 parts In-Stock

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Kepictronics

USA . 4,796 parts In-Stock

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Corphita

USA . 1,932 parts In-Stock

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Kulean Microsystems

USA . 1,410 parts In-Stock

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SupplyDigital Components

Austria . 1,132 parts In-Stock

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UHIMA Technologies

Türkiye . 530 parts In-Stock

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Corohmni

South Africa . 291 parts In-Stock

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Overview

Discover the cutting-edge LC78637E by Onsemi, a top-tier manufacturer known for its superior quality and reliability. This versatile consumer IC offers endless possibilities in various applications, providing unmatched value and benefits to customers. With its advanced technology and innovative design, this product ensures optimal performance and efficiency. Experience the exceptional advantages of the LC78637E and elevate your projects to new heights with Onsemi's expertise and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability, making this product suitable for various consumer applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, making the product ideal for manufacturing processes.

Package Shape: SQUARE

The square package shape provides a compact design, making it space-saving and suitable for applications with limited space.

Power Supplies (V): 3.3

Operating at 3.3V makes this product compatible with a wide range of electronic devices and systems that require low voltage power supplies.

No. of Terminals: 80

Having 80 terminals allows for versatile connectivity options, making this product suitable for complex circuit designs and configurations.

Package Style (Meter): FLATPACK

The flatpack package style offers efficient heat dissipation and improved thermal performance, enhancing the overall reliability of the product.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand higher temperatures, making it suitable for applications where heat dissipation is crucial.

Minimum Operating Temperature: -20 °C

Operating at temperatures as low as -20 °C ensures that this product can function reliably in various environmental conditions, making it versatile and robust.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections, reducing the risk of signal disruptions and making this product suitable for high-demand applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high speed performance, making this product energy-efficient and ideal for applications requiring fast data processing.

Terminal Form: GULL WING

The gull wing terminal form provides reliable solder joints and easy soldering processes, ensuring secure connections and making this product suitable for automated assembly.

Terminal Pitch: 0.635 mm

With a terminal pitch of 0.635mm, this product offers precise and fine-pitch connections, making it suitable for high-density PCB designs and miniaturized applications.

Technical Specifications

Other Function Consumer ICs LC78637E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G80

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.68SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Trade Compliance

LC78637E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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