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LC786821E-6E04-3H

Onsemi

LC786821E-6E04-3H by Onsemi

LC786821E-6E04-3H by Onsemi is a consumer circuit IC with 100 terminals in a rectangular flatpack package. It operates b/w -40 to 85 °C, with a supply voltage range of 3V to 3.6V. This IC is suitable for industrial applications requiring a compact design and surface mount capability.

Median Price

$16.292

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,423 parts In-Stock

1+ parts

$16.292

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1,423

$16.292

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Vyrian

USA . 4,732 parts In-Stock

1+ parts

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4,732

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Flip Electronics

USA . 22 parts In-Stock

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22

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 682 parts In-Stock

1+ parts

$13.330

100+ parts

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682

$13.330

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Corphita

USA . 69 parts In-Stock

1+ parts

$15.435

100+ parts

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69

$15.435

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Corohmni

South Africa . 392 parts In-Stock

1+ parts

$15.910

100+ parts

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392

$15.910

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Microchip USA

USA . 2,628 parts In-Stock

1+ parts

$30.755

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2,628

$30.755

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Problanco Electronics

Mexico . 8,225 parts In-Stock

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8,225

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TANS Electronics

Latvia . 8,145 parts In-Stock

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8,145

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SupplyDigital Components

Austria . 5,114 parts In-Stock

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5,114

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Kulean Microsystems

USA . 4,953 parts In-Stock

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4,953

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UHIMA Technologies

Türkiye . 714 parts In-Stock

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714

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Overview

Discover the LC786821E-6E04-3H by Onsemi, a top-tier manufacturer known for delivering high-quality consumer ICs. This innovative product offers unmatched performance and reliability in a compact package, making it ideal for a wide range of applications. With a temperature range of -40 °C to 85°C and a maximum supply voltage of 3.6V, this versatile IC provides exceptional value and benefits to customers looking for cutting-edge solutions. Trust Onsemi to deliver excellence with the LC786821E-6E04-3H.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy and quick assembly of the product onto circuit boards.

Package Shape: RECTANGULAR

Rectangular shape provides a compact form factor for efficient PCB layout and space utilization.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and reliability in consumer electronics.

No. of Terminals: 100

Having a high number of terminals allows for complex circuit connections and functionalities.

Terminal Finish: TIN BISMUTH

Tin bismuth finish provides good solderability and reliability in various operating conditions.

Maximum Operating Temperature: 85 °C

Operates efficiently up to a maximum temperature of 85 °C, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Works reliably even in extreme cold temperatures down to -40 °C, ensuring robust performance.

Width: 14 mm

Compact width allows for space-saving integration into electronic devices and systems.

Length: 20 mm

Optimal length provides a balance between functionality and compactness in the overall design of the product.

Technical Specifications

Other Function Consumer ICs LC786821E-6E04-3H attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e6

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.79X.55

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Maximum Seated Height:

3 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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