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LC78604E

Onsemi

LC78604E by Onsemi

LC78604E by Onsemi is a consumer circuit IC with 64 terminals, operating at temperatures from -20 °C to 70°C. It has a power supply of 3.3V and uses CMOS technology. This surface-mount IC in a square package is ideal for various consumer electronic applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,315 parts In-Stock

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Vyrian

USA . 298 parts In-Stock

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298

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Kulean Microsystems

USA . 7,995 parts In-Stock

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7,995

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Problanco Electronics

Mexico . 5,278 parts In-Stock

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TANS Electronics

Latvia . 4,682 parts In-Stock

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4,682

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SupplyDigital Components

Austria . 3,831 parts In-Stock

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3,831

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UHIMA Technologies

Türkiye . 457 parts In-Stock

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457

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Corohmni

South Africa . 360 parts In-Stock

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Corphita

USA . 100 parts In-Stock

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Overview

Experience the unbeatable quality and innovation of Onsemi with the LC78604E, a cutting-edge consumer circuit IC that offers unparalleled performance and reliability. This versatile component, housed in a durable plastic/epoxy package, is designed for a wide range of applications, from consumer electronics to automotive systems. With a low power supply of 3.3V and a compact square shape, the LC78604E delivers efficiency and functionality in a sleek flatpack style. Trust Onsemi to bring you the latest in CMOS technology, ensuring optimal performance even in extreme temperatures. Upgrade your products today with the LC78604E and unlock a world of possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in consumer electronic products due to its lightweight and durable nature, making the product ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for compact and efficient circuit board design, saving space and reducing manufacturing complexity.

Package Shape: SQUARE

Square packages are easy to handle and align on circuit boards, simplifying the assembly process.

Power Supplies (V): 3.3

Operating at a low voltage of 3.3V helps reduce power consumption, making the product energy-efficient.

No. of Terminals: 64

Having a high number of terminals allows for more connectivity options and functionality in the device.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the product can withstand typical environmental conditions without overheating.

Minimum Operating Temperature: -20 °C

The product can operate efficiently in low temperatures down to -20 °C, making it suitable for a wide range of applications.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for reliability and performance in consumer electronics.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices, enhancing the reliability and efficiency of the product.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections, preventing solder bridges and ensuring stable performance in the device.

Terminal Pitch: 0.8 mm

With a small terminal pitch of 0.8 mm, the product can accommodate densely packed components on the circuit board, enabling high circuit density and miniaturization.

Technical Specifications

Other Function Consumer ICs LC78604E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LC78604E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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