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LC786800E

Onsemi

LC786800E by Onsemi

LC786800E by Onsemi is a consumer circuit IC with 100 terminals in a rectangular flatpack package. Operating temperature ranges from -40 to 85 °C, suitable for industrial applications. Features include CMOS technology, 3-3.6V supply voltage, and compact dimensions of 20x14x3mm for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,892 parts In-Stock

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1,892

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Digiode

USA . 1,483 parts In-Stock

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1,483

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 7,335 parts In-Stock

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7,335

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SupplyDigital Components

Austria . 6,896 parts In-Stock

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6,896

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Kulean Microsystems

USA . 4,767 parts In-Stock

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4,767

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Problanco Electronics

Mexico . 3,550 parts In-Stock

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3,550

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Corphita

USA . 1,755 parts In-Stock

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1,755

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UHIMA Technologies

Türkiye . 510 parts In-Stock

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510

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Corohmni

South Africa . 363 parts In-Stock

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363

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Overview

Unlock the full potential of your consumer electronics with the LC786800E by Onsemi. As a trusted manufacturer, Onsemi ensures top-notch quality and reliability in all their products, making this IC a must-have for various applications. From household appliances to entertainment devices, the LC786800E offers unparalleled value, benefits, and advantages to customers looking for seamless performance and efficiency. Upgrade your electronics with the LC786800E and experience a whole new level of innovation and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for consumer applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving on manufacturing costs.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to place and mount the IC on a PCB, optimizing space utilization.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliable performance and compatibility in consumer devices.

No. of Terminals: 100

High number of terminals allow for versatile connectivity options and functionality in the circuit design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the IC can operate in both extreme cold and hot conditions, making it versatile for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable in consumer devices.

Technical Specifications

Other Function Consumer ICs LC786800E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

3 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LC786800E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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