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LC78692NW

Onsemi

LC78692NW by Onsemi

LC78692NW by Onsemi is a consumer circuit IC with 80 terminals in a square flatpack package. Operating temperature ranges from -20 °C to 70°C, suitable for commercial applications. It operates at 3.3V power supply and utilizes CMOS technology for various consumer electronic functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,740 parts In-Stock

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1,740

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Vyrian

USA . 1,359 parts In-Stock

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1,359

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,750 parts In-Stock

1+ parts

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7,750

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TANS Electronics

Latvia . 7,393 parts In-Stock

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7,393

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SupplyDigital Components

Austria . 6,086 parts In-Stock

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6,086

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Kulean Microsystems

USA . 5,903 parts In-Stock

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5,903

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UHIMA Technologies

Türkiye . 371 parts In-Stock

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371

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Corphita

USA . 322 parts In-Stock

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322

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Corohmni

South Africa . 154 parts In-Stock

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154

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Overview

Unleash the power of innovation with the LC78692NW by Onsemi. Designed with precision and expertise, this consumer circuit IC offers unmatched quality and reliability. Ideal for a wide range of applications, this product is a game-changer in the electronics industry. Experience seamless performance and efficiency with this cutting-edge technology. Elevate your projects with the LC78692NW and discover a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and good heat resistance, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: SQUARE

Square package shape aids in better utilization of space on the PCB, improving overall design efficiency.

Power Supplies (V): 3.3

Operating at 3.3 volts provides good power efficiency, reducing power consumption and heat generation.

No. of Terminals: 80

Having 80 terminals allows for a versatile range of connections and functionalities, making the product suitable for diverse applications.

Package Style (Meter): FLATPACK

Flatpack style optimizes space usage and allows for easy integration into compact electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the product can perform reliably even under moderate heat conditions.

Minimum Operating Temperature: -20 °C

Operating at temperatures as low as -20 °C ensures the product's functionality in a wide range of environments.

Temperature Grade: COMMERCIAL

Commercial-grade temperature tolerance makes the product suitable for standard consumer applications in various industries.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and ease of soldering during assembly, ensuring reliability and durability.

Terminal Pitch: 0.5 mm

Having a terminal pitch of 0.5mm enables high-density mounting and efficient use of PCB space, making the product suitable for compact designs.

Technical Specifications

Other Function Consumer ICs LC78692NW attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G80

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC78692NW General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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