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LC78615E-01US-H

Onsemi

LC78615E-01US-H by Onsemi

LC78615E-01US-H by Onsemi is a 64-terminal consumer IC with CMOS technology. Operating b/w -40 to 85 °C, it has a supply voltage range of 3-3.6V and peak reflow temp of 260°C. Ideal for industrial applications requiring a flatpack package style in a compact 14x14mm square body.

Median Price

$1.891

Lifecycle Status

EOL

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 299 parts In-Stock

1+ parts

$3.220

100+ parts

$2.370

1k+ parts

$2.370

10k+ parts

$2.370

299

$3.220

$2.370

$2.370

$2.370

Rochester

USA . 1,061 parts In-Stock

1+ parts

-

100+ parts

$1.570

1k+ parts

$1.400

10k+ parts

$1.320

1,061

-

$1.570

$1.400

$1.320

DigiKey

USA . 911 parts In-Stock

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$1.820

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911

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$1.820

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Verical

USA . 300 parts In-Stock

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$1.962

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300

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$1.962

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Distributors (In-Stock)

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Digiode

USA . 1,333 parts In-Stock

1+ parts

$1.662

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$1.662

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Vyrian

USA . 2,159 parts In-Stock

1+ parts

$1.750

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2,159

$1.750

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Flip Electronics

USA . 2,332 parts In-Stock

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2,332

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Distributors (Availability)

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Corphita

USA . 1,257 parts In-Stock

1+ parts

$1.575

100+ parts

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1,257

$1.575

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Corohmni

South Africa . 269 parts In-Stock

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$1.750

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269

$1.750

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QUARKTWIN TECHNOLOGY LTD

USA . 17,818 parts In-Stock

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Problanco Electronics

Mexico . 7,820 parts In-Stock

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7,820

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TANS Electronics

Latvia . 6,699 parts In-Stock

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6,699

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Microchip USA

USA . 3,515 parts In-Stock

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3,515

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SupplyDigital Components

Austria . 2,845 parts In-Stock

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2,845

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Kulean Microsystems

USA . 1,837 parts In-Stock

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1,837

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UHIMA Technologies

Türkiye . 912 parts In-Stock

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912

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Kepictronics

USA . 156 parts In-Stock

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156

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Overview

Unleash the power of innovation with the LC78615E-01US-H by Onsemi. As a leader in consumer ICs, Onsemi delivers cutting-edge technology packaged in a compact and durable design. Perfect for a wide range of applications, this high-quality product offers reliability and efficiency that you can trust. Elevate your projects with the LC78615E-01US-H and experience the benefits of top-notch performance and value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape offers a compact and space-saving design, making it ideal for applications where board space is limited.

General IC Type: CONSUMER CIRCUIT

Being designed as a consumer circuit IC, this product is optimized for use in consumer electronics, ensuring reliable performance and compatibility.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand harsh environmental conditions and extended use without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C enables this product to function effectively in cold environments or during temperature fluctuations.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable for various applications.

Technical Specifications

Other Function Consumer ICs LC78615E-01US-H attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e6

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Maximum Seated Height:

3 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

LC78615E-01US-H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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