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LC786820E

Onsemi

LC786820E by Onsemi

LC786820E by Onsemi is a consumer IC with 100 terminals in a rectangular flatpack package. Operating temperature ranges from -40 to 85 °C, suitable for industrial applications. Features include a min supply voltage of 3V and max seated height of 3mm, making it ideal for compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,762 parts In-Stock

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1,762

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Digiode

USA . 631 parts In-Stock

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631

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 8,100 parts In-Stock

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8,100

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TANS Electronics

Latvia . 5,650 parts In-Stock

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5,650

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Problanco Electronics

Mexico . 5,518 parts In-Stock

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5,518

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Corphita

USA . 2,245 parts In-Stock

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2,245

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Kulean Microsystems

USA . 1,959 parts In-Stock

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1,959

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Corohmni

South Africa . 163 parts In-Stock

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163

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UHIMA Technologies

Türkiye . 83 parts In-Stock

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83

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Overview

Unlock the power of cutting-edge technology with the LC786820E from Onsemi. Crafted with precision and expertise, this consumer IC offers unparalleled quality and reliability. Perfect for a wide range of applications, this product provides exceptional performance, efficiency, and functionality. Experience the value and benefits of seamless integration, high durability, and optimal performance. Elevate your projects to new heights with the LC786820E by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient use of space on circuit boards.

General IC Type: CONSUMER CIRCUIT

Designed for consumer circuits, this IC is suitable for a wide range of consumer electronics applications.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for various circuit configurations.

Package Style (Meter): FLATPACK

The flatpack package style is compact and helps in saving space in electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand challenging thermal conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Position: QUAD

The quad terminal position facilitates easy and organized connection to external components.

Maximum Seated Height: 3 mm

The low maximum seated height contributes to a compact design and ease of integration in devices.

Width: 14 mm

The 14mm width allows for a slim form factor and efficient use of board space.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement makes the IC suitable for low power applications.

Length: 20 mm

The 20mm length offers a balanced design that fits well in various electronic setups.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability in harsh operating environments.

Terminal Form: FLAT

The flat terminal form simplifies soldering and enhances connectivity during assembly.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65mm enables high-density routing and compact PCB layouts.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6 V, the IC can handle a range of voltage inputs for versatility.

Technical Specifications

Other Function Consumer ICs LC786820E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.67X.9

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

3 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LC786820E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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