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LC78605E

Onsemi

LC78605E by Onsemi

LC78605E by Onsemi is a 64-terminal consumer circuit IC with CMOS technology. It operates b/w -20 °C to 75°C, suitable for commercial extended temperature grade applications. The flatpack package style with gull wing terminals and quad terminal position makes it ideal for surface mount consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,708 parts In-Stock

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Vyrian

USA . 1,506 parts In-Stock

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1,506

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TANS Electronics

Latvia . 7,745 parts In-Stock

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SupplyDigital Components

Austria . 5,842 parts In-Stock

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Problanco Electronics

Mexico . 3,342 parts In-Stock

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Corphita

USA . 1,640 parts In-Stock

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Kulean Microsystems

USA . 1,558 parts In-Stock

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UHIMA Technologies

Türkiye . 341 parts In-Stock

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Corohmni

South Africa . 173 parts In-Stock

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Overview

Revolutionize your consumer electronics with the LC78605E by Onsemi. As a leading manufacturer in the industry, Onsemi's quality and innovation shine through in this versatile product. Perfect for a variety of consumer applications, this IC offers unmatched value, benefits, and advantages to customers. Say goodbye to limitations and hello to endless possibilities with the LC78605E. Elevate your products to new heights with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for consumer electronics applications.

Surface Mount: YES

Being surface mountable makes the product easy to integrate onto PCBs, saving space and making assembly more efficient.

Package Shape: SQUARE

The square package shape allows for easier handling and placement on the circuit board, facilitating the manufacturing process.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics applications, ensuring compatibility and optimal performance in such devices.

No. of Terminals: 64

Having 64 terminals allows for a wide range of connections and functionalities, making this product versatile and suitable for various applications.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and compact design, ideal for space-constrained electronic devices.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75 °C, this product can withstand high temperature environments, ensuring reliable performance.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20 °C makes this product suitable for use in a variety of environments.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections, reducing the risk of disconnection or signal interference.

Maximum Seated Height: 3 mm

The low seated height of 3mm helps in reducing the overall profile of the product, important for slim and compact electronic devices.

Width: 14 mm

The 14mm width provides a balance between compactness and ease of handling during assembly and integration.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage of 3V ensures compatibility with a wide range of power sources, making this product versatile.

Length: 14 mm

The 14mm length offers a compact form factor, allowing the product to fit into tight spaces within electronic devices.

Temperature Grade: COMMERCIAL EXTENDED

Designed for commercial extended temperature range, making this product suitable for a variety of consumer applications in different environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form provides a strong and reliable connection, enhancing the durability and performance of the product.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, this product offers precise connections and efficient use of PCB space, enhancing overall design flexibility.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V allows for flexibility in power input, accommodating different voltage requirements in various applications.

Technical Specifications

Other Function Consumer ICs LC78605E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.7SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

3 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LC78605E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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